Abstract: In the present invention, the position of a substrate on a thermal plate is detected when baking after exposure is performed in a first round of patterning. In a second round of patterning, the setting position of the substrate is adjusted based on a detection result of the position before the substrate is mounted on the thermal plate in the baking after exposure. In the baking after exposure in the second round of patterning, the substrate is mounted at the same position with respect to the thermal plate as that in the baking after exposure in the first round of patterning. In performing a plurality of rounds of patterning on a film to be processed, a pattern with a desired dimension is finally formed above the substrate, and the uniformity of the pattern dimension within the substrate is ensured.

Abstract: The nozzle member of a fluid nozzle includes at least one through hole that is parallel to a center axis, wherein a diameter dimension of the through hole is 10 ?m to 100 ?m, a length-to-diameter ratio (L/D) of the through hole is 5 or above, and the nozzle member is formed of ceramics having relative density of 95% or above. The nozzle member including a plurality of minute through holes is manufactured by performing extrusion or cast molding in such a way that a molded body includes a filament of synthetic resin, carbon, or metal in a direction of the center axis of the molded body, and then defatting/sintering the molded body after removing the filament or, when the filament is formed of synthetic resin or carbon, defatting/sintering the molded body under oxidizing atmosphere to evaporate and remove the filament without removing the filament from the molded body.

Abstract: A dummy substrate (17) differs from a substrate to be processed in having a first guide (G1) for assisting centering, however, it can be handled as a substitute of the substrate to be processed. In a process chamber (2), a second guide (G2) is arranged to assist the dummy substrate (17) to center. To detect a transfer shift of a transfer mechanism (TRM), at first, the dummy substrate (17) is centered to a placing table (14) on the placing table (14) or at an upper position thereof by engagement of the first and the second guides (G1, G2). The dummy substrate (17) centered in such a manner is received by the transfer mechanism (TRM) and transferred to a detector (11). Then, a detection value of a decentering quantity and that in a decentering direction of the dummy substrate (17) are obtained by the detector (11), and a transfer shift of the transfer mechanism (TRM) is obtained based on the detection values.