Patents Assigned to Tokyo Electron FE Limited
  • Patent number: 5722441
    Abstract: A process apparatus for processing semiconductor wafers. It includes a process vessel in which process solution is contained. In the process solution, the wafers are immersed and processed. A supply pipe extends from the process vessel to solution storing vessels. Component solutions are stored in the component solution storing vessels and supplied from them to the process vessel to keep the concentration of each component in process solution. A supply pump is attached to the supply pipe. Valves for adjusting the amount of each component supplied are attached to the supply pipe. The adjusting valves are electrically connected to a CPU. Data representing that concentration of each component in process solution which changes with passage of time are previously stored in the CPU. The CPU controls the adjusting valves on the basis of the data to supply component solutions into the process vessel so as to meet any change in the concentration of each component in process solution in the process vessel.
    Type: Grant
    Filed: November 19, 1996
    Date of Patent: March 3, 1998
    Assignees: Tokyo Electron Limited, Tokyo Electron FE Limited
    Inventor: Masashi Teramoto
  • Patent number: 5644245
    Abstract: A probe apparatus for inspecting electrical characteristics of a microelectronic element formed on a substrate and having a plurality of pads including a probe card having a plurality of probe needles, an image pick-up device for picking up images of the pads and the probe needles, a registration device which previously stores pad position information indicating pad positions of at least specified of the pads and needle position information indicating needle positions of at least specified of the plurality of probe needles, the needle positions being obtained by an actual measurement based on the images picked up by the image pick-up device, and a control processor for executing a task for detecting imaginary needle marks formed on the pads by imaginarily bringing the specified probe needles and the pads corresponding thereto into contact with each other, by overlapping the first position information and the pad position information of the microelectronic element, a task for detecting positional deviation inf
    Type: Grant
    Filed: November 23, 1994
    Date of Patent: July 1, 1997
    Assignees: Tokyo Electron Limited, Tokyo Electron FE Limited
    Inventors: Satoshi Saitoh, Akihiro Terada