Patents Assigned to TOKYO ELECTRONICS LIMITED
  • Patent number: 11091836
    Abstract: A graphene structure forming method for forming a graphene structure is provided. The method comprises preparing a target substrate, and forming the graphene structure on a surface of the target substrate by remote microwave plasma CVD using a carbon-containing gas as a film-forming raw material gas in a state in which the surface of the target substrate has no catalytic function.
    Type: Grant
    Filed: September 14, 2018
    Date of Patent: August 17, 2021
    Assignee: TOKYO ELECTRONICS LIMITED
    Inventors: Ryota Ifuku, Takashi Matsumoto
  • Patent number: 10043692
    Abstract: A substrate processing apparatus includes a substrate processing device, a substrate accommodation-status detection device, a substrate-transport device including a first substrate-transport sub-device which unloads substrates from a carrier and a second substrate-transport sub-device which unloads the substrates from the carrier, a control device including processing circuitry which controls the first and second substrate-transport sub-devices based on detection result of the substrate accommodation-status detection device.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: August 7, 2018
    Assignee: TOKYO ELECTRONICS LIMITED
    Inventors: Go Ayabe, Kouji Takuma
  • Patent number: 9543123
    Abstract: A plasma generation antenna and a plasma processing apparatus can supply a gas and an electromagnetic wave effectively. A plasma processing apparatus 10 includes a processing chamber 100 in which a plasma process is performed; a wavelength shortening plate 480 configured to transmit an electromagnetic wave; and a plasma generation antenna 200 having a shower head 210 provided adjacent to the wavelength shortening plate 480. The shower head 210 is made of a conductor, and has a multiple number of gas holes 215 and a multiple number of slots 220 through which the electromagnetic wave passes. The slots 220 are provided at positions isolated from the gas holes 215.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: January 10, 2017
    Assignee: TOKYO ELECTRONICS LIMITED
    Inventors: Taro Ikeda, Tomohito Komatsu, Shigeru Kasai
  • Patent number: 9209055
    Abstract: A bypass route is provided in order to transfer a substrate without passing through the atmospheric pressure transfer chamber, that is, a loader module, from a load lock chamber to a storage. In the bypass route, a sub-transfer unit for transferring the processed substrate from the load lock chamber to the storage is provided. The sub-transfer unit transfers the processed substrate from the load lock chamber to the storage, and a main transfer unit of the loader module returns the processed substrate from the storage to a transport container on holding stage.
    Type: Grant
    Filed: October 18, 2013
    Date of Patent: December 8, 2015
    Assignee: TOKYO ELECTRONICS LIMITED
    Inventor: Tsutomu Hiroki