Patents Assigned to Tokyo Hi-Tech Co., Ltd.
  • Patent number: 5692423
    Abstract: A vibration finishing method and apparatus in which the surface roughness and form of a hole in a compound material such as a printed board can be made excellent and the working accuracy of the hole can be significantly improved and the working cost of the hole can be lowered. In the punch pressing device, a compound material is fixed to a lower metal mold having a lower die hole into which a punching tool can be inserted. While the compound material is held between the lower metal mold and a pressing plate and pressed by pressing members provided with the pressing plate having an upper die hole into which the punching tool can be inserted, a minute-vibration of frequency of several ten hertz is applied onto the punching tool and then, the compound material is punched out. After that, the punching tool is temporarily drawn from the hole to be worked in the compound material.
    Type: Grant
    Filed: May 9, 1995
    Date of Patent: December 2, 1997
    Assignees: Kabushiki Kaisha Fujikoshi, Tokyo Hi-Tech Co., Ltd.
    Inventors: Syuichi Hachikawa, Yasumasa Kataoka