Patents Assigned to Tokyo Print Co., Ltd.
  • Method for applying a solder resist ink to a printed wiring board
    Patent number: 4301189
    Abstract: A method of manufacturing a printed wiring board completely free from trouble of solder bridging. The printed wiring board of the present invention is provided with a raised portion of solder resist ink in the form of a ridge around the periphery of the land to be printed or at an area between adjacent lands to be soldered, the said raised portion being an extension of a solder resist thin layer coated on the insulator base board exclusive the said land.
    Type: Grant
    Filed: June 2, 1980
    Date of Patent: November 17, 1981
    Assignee: Tokyo Print Co., Ltd.
    Inventors: Minoru Arai, Akio Baba