Patents Assigned to TOKYO SEIMITSU HATSUJO CO., LTD.
  • Patent number: 11787002
    Abstract: A novel structure of a spiral conveyor is provided which is also suitable for conveyance of curl-shape and permanent-shape cuttings in a lathe system while suppressing the occurrence of noise caused by vibration. At the lowest point, a conveyance spiral of this spiral conveyor for conveying chips contacts the ground (the ground point P) at the lowest point of a tray, and the conveyance spiral is not in contact with a pair of rails in opposite positions on the inner surface of the tray and extending in the length direction, and small gaps t are formed between the conveyance spiral and the rails. Because it is only at the lowest point that the conveyance spiral contacts the tray, similarly to conventional rail-less designs, a low level of noise is achieved, similar to that in the rail-less designs.
    Type: Grant
    Filed: August 18, 2020
    Date of Patent: October 17, 2023
    Assignee: TOKYO SEIMITSU HATSUJO CO., LTD.
    Inventors: Takaaki Maeda, Sugihide Nakashima
  • Patent number: 10501266
    Abstract: A spiral conveyor having a novel structure that is adapted to handle any chip while having a simple structure and is capable of achieving low vibration and low noise is provided. A tray for a spiral conveyor is configured from an outer tray, an inner tray which is placed over the inside of the outer tray, and a vibration damping material which is interposed between the outer tray and the inner tray. The tray has a fixing means for detachably fixing the inner tray and the vibration damping material to the outer tray on the outside of a conveyance spiral casing.
    Type: Grant
    Filed: June 21, 2017
    Date of Patent: December 10, 2019
    Assignee: TOKYO SEIMITSU HATSUJO CO., LTD.
    Inventors: Takaaki Maeda, Sugihide Nakashima
  • Publication number: 20190168970
    Abstract: A spiral conveyor having a novel structure that is adapted to handle any chip while having a simple structure and is capable of achieving low vibration and low noise is provided. A tray for a spiral conveyor is configured from an outer tray, an inner tray which is placed over the inside of the outer tray, and a vibration damping material which is interposed between the outer tray and the inner tray. The tray has a fixing means for detachably fixing the inner tray and the vibration damping material to the outer tray on the outside of a conveyance spiral casing.
    Type: Application
    Filed: June 21, 2017
    Publication date: June 6, 2019
    Applicant: TOKYO SEIMITSU HATSUJO CO.,LTD.
    Inventors: Takaaki Maeda, Sugihide Nakashima
  • Patent number: 10207304
    Abstract: A metal plate bending device, including a lower die having a main body including a pair of arc-shaped cross-sectional recesses formed on an upper surface in a symmetric design with respect to a center line, and swingable members swingably received in said recesses respectively. An upper die is arranged above said lower die movably along said center line relative to said lower die, wherein said upper die is moved toward a metal plate mounted on said lower die causing a press-push force to said metal plate to, causing said swingable members to swing and bend said metal plate along said center line. A movable plate is slideably in planar contact with a flat upper surface of the swingable members and is a flat supporting surface. During bending, said movable plate is slideable with respect to said swingable member, and is moved together with said metal plate.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: February 19, 2019
    Assignee: TOKYO SEIMITSU HATSUJO CO., LTD.
    Inventor: Takaaki Maeda
  • Patent number: 9878359
    Abstract: [Problem] To provide a bending device with a novel structure capable of efficiently bending a metallic plate without scratching or denting the plate. [Solution] A device (10) for bending a metallic plate (W) mounted on a pair of movable plates (35, 35) by applying pressing force to the metallic plate by an upper die (20) along a central axis (X), wherein against the biasing force of a coil spring (45), the movable plates move with the extension of the metallic plate during bending, and therefore the metallic plate is not scratched. The upper surface of each of the movable plates is a perfect flat surface, and therefore does not dent the metallic plate being subjected to the pressing force by the upper die.
    Type: Grant
    Filed: March 3, 2015
    Date of Patent: January 30, 2018
    Assignee: TOKYO SEIMITSU HATSUJO CO., LTD.
    Inventor: Takaaki Maeda
  • Publication number: 20160121382
    Abstract: [Problem] To provide a bending device with a novel structure capable of efficiently bending a metallic plate without scratching or denting the plate. [Solution] A device (10) for bending a metallic plate (W) mounted on a pair of movable plates (35, 35) by applying pressing force to the metallic plate by an upper die (20) along a central axis (X), wherein against the biasing force of a coil spring (45), the movable plates move with the extension of the metallic plate during bending, and therefore the metallic plate is not scratched. The upper surface of each of the movable plates is a perfect flat surface, and therefore does not dent the metallic plate being subjected to the pressing force by the upper die.
    Type: Application
    Filed: March 3, 2015
    Publication date: May 5, 2016
    Applicant: TOKYO SEIMITSU HATSUJO CO., LTD.
    Inventor: Takaaki MAEDA