Patents Assigned to Tokyo Seimitus Co., Ltd.
  • Method and apparatus for cutting a cylindrical material
    Patent number: 4903681
    Abstract: Method and apparatus for cutting a cylindrical material formed of silicone or the like which is an original material to produce semiconductor devices, using a rotary blade. In the cutting method, the base end side of the cylindrical material is fixed and at the same time, before the cutting of the cylindrical material is started, the cutting side of the cylindrical material is also fixed according to the shape thereof. The cutting is performed while maintaining such fixed conditions until the cutting is completed.
    Type: Grant
    Filed: February 18, 1988
    Date of Patent: February 27, 1990
    Assignee: Tokyo Seimitus Co., Ltd.
    Inventors: Katsuo Honda, Shuichi Tsukada