Patents Assigned to Tokyo Shinzyu Co., Ltd.
  • Diamond cutting method and diamond provided by the method
    Patent number: 7228856
    Abstract: Ten of pavilion main facets are formed with reference to the previously formed five of first pavilion main facets in which an initial first main facet is formed in a position centered on a line shifted approximately fifteen degrees from the ridge of the raw diamond on the pavilion side. Ten of pavilion main facets 19 radiate from the curette 18 and twenty of lower girdle facets are formed between the adjacent pavilion main facets on the pavilion side of the diamond 1.
    Type: Grant
    Filed: February 12, 2004
    Date of Patent: June 12, 2007
    Assignee: Tokyo Shinzyu Co., Ltd.
    Inventor: Takeshi Aoyagi