Patents Assigned to Tokyo University of Sci. Ed. Foundation Admin. Org
  • Publication number: 20150079341
    Abstract: Disclosed is fabrication of a resin compact using a mold. The mold includes a resin mold body satisfies any one of conditions which are: a width of a protrusion is 5 nm or greater and less than 50 nm, an aspect ratio of the protrusion is 2 or greater, and Martens hardness is 200 or greater; the width of the protrusion is 50 nm or greater and less than 100 nm, the aspect ratio of the protrusion is 3 or greater, and Martens hardness is 200 or greater; and the width of the protrusion is 100 nm or greater and less than 1 ?m, the aspect ratio of the protrusion is 4 or greater, and Martens hardness is 150 or greater. The inversion pattern has a space between the adjacent protrusions less than twice a height of the protrusion. The mold further includes an adhesion layer and a release layer.
    Type: Application
    Filed: September 16, 2013
    Publication date: March 19, 2015
    Applicants: Tokyo University of Sci. Ed. Foundation Admin. Org, KURARAY Co., Ltd.
    Inventors: Go TAZAKI, Toshiyuki Zento, Jun Taniguchi