Patents Assigned to Tomoegawa Co., Ltd.
  • Publication number: 20210176854
    Abstract: A multilayer printed wiring board including one or more insulating layers 2 and at least one conductive layer 1 which are stacked alternately is disclosed. The one or more insulating layers 2 include at least one liquid crystal polymer resin layer 4 so that each of the one or more insulating layers 2 includes at least one layer selected from a group consisting of at least one polyolefin resin layer 3 and the at least one liquid crystal polymer resin layer 4. A percentage by volume of the at least one liquid crystal polymer resin layer 4 relative to the one or more insulating layers 2 is within a range of 5 to 90%.
    Type: Application
    Filed: February 10, 2021
    Publication date: June 10, 2021
    Applicants: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., TOMOEGAWA CO., LTD.
    Inventors: Hiroaki TAKAHASHI, Kiyotaka KOMORI, Masaya KOYAMA, Jun TOCHIHIRA, Ryu HARADA
  • Publication number: 20210132299
    Abstract: A cleaning tool that cleans an optical connector includes an adhesive body that contacts an optical signal region of the optical connector where an optical signal enters and is emitted from the optical connector; and a base that holds the adhesive body. The base includes a first protrusion on a holding surface of a holding part that holds the adhesive body. The first protrusion is disposed at a rear side of a section of the adhesive body and is in contact with the optical signal region.
    Type: Application
    Filed: March 6, 2018
    Publication date: May 6, 2021
    Applicants: FUJIKURA LTD., TOMOEGAWA CO., LTD.
    Inventors: Akihiro Nakama, Shigeo Takahashi, Hirotaka Asada, Makoto Goto, Masayoshi Suzuki
  • Patent number: 10988876
    Abstract: The present invention provides a cushion member and a stage member provided with the cushion member, the cushion member including a non-woven fabric formed by binding or entangling metal fibers, wherein when the cushion member is compressed, the cushion member undergoes compressive deformation and the following compressive deformation ratio is 5% to 80%: Compressive deformation ratio=(T0?T1)/T0×100, T0: film thickness of cushion member before application of load, and T1: film thickness of cushion member after application and release of load.
    Type: Grant
    Filed: January 10, 2018
    Date of Patent: April 27, 2021
    Assignee: Tomoegawa Co., Ltd
    Inventors: Katsuya Okumura, Hajime Tsuda
  • Patent number: 10843445
    Abstract: A sheet-shaped matched-type electromagnetic wave absorber can obtain electromagnetic wave absorption performance with a relatively small thickness but has a problem that particularly a dimensional change in an electromagnetic wave absorption layer (resin composition layer) has a large influence on the electromagnetic wave absorption performance when being exposed to a high temperature. By laminating a resin composition layer in which a filler with an aspect ratio of 5 or more and a filler with an aspect ratio of less than 5 are dispersed and fixed with an electromagnetic wave reflection layer in a cured product of a resin composition containing an acrylic polymerizable resin and a polymerization initiator, it is possible to provide a matched-type electromagnetic wave absorber having high heat resistant dimensional stability and high electromagnetic wave absorption performance.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: November 24, 2020
    Assignee: Tomoegawa Co., Ltd.
    Inventors: Takeshi Hashimoto, Takuma Hattori, Kojiro Tsuruta
  • Patent number: 10822527
    Abstract: This thermosetting adhesive composition contains as a component (A) a vinyl compound in which a terminal end of a bifunctional polyphenylene ether oligomer is converted to a vinyl group, as a component (B) a maleimide resin, and as a component (C) a thermoplastic elastomer, the equivalent ratio of vinyl groups in the component (A) and maleimide groups in the component (B) being 1.0:0.5 to 1.0:4.0, the proportion of the component (C) in the total weight of the component (A), the component (B), and the component (C) being 55 to 95% by weight, the ratio of styrene units of the component (C) with respect to the total weight of the component (C) being 10 to 40% by weight, the tensile stress at 100% elongation being 0.1 to 2.9 MPa, and the elongation at break being 100% or greater.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: November 3, 2020
    Assignee: Tomoegawa Co., Ltd.
    Inventors: Jun Tochihira, Ryu Harada
  • Patent number: 10751976
    Abstract: A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: August 25, 2020
    Assignees: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., TOMOEGAWA CO., LTD.
    Inventors: Yohsuke Ishikawa, Yoshiaki Esaki, Takayoshi Ozeki, Jun Tochihira, Ryu Harada
  • Publication number: 20200267864
    Abstract: A resin card medium which has a substrate having electronic components mounted thereon and has sophisticated flatness and smoothness realized without providing any layer having holes for absorbing thicknesses of the electronic components; and a method for manufacturing a resin card medium. A resin card medium laminated body before pressing is prepared by laminating, on a first plastic finishing sheet, a substrate having one electronic component or two or more electronic components installed on one side of the substrate, with the one side, on which the electronic component or electronic components are installed, facing upward, and laminating, on the substrate, mixed paper constituted of plastic fibers and plant fibers, and by subjecting the resin card medium laminated body to hot pressing at a temperature which is a softening point or more of the plastic fibers and less than a melting point of the plastic fibers.
    Type: Application
    Filed: September 20, 2018
    Publication date: August 20, 2020
    Applicants: SHOEI PRINTING CO., LTD., TOMOEGAWA CO., LTD.
    Inventors: Tomohiro NAKATA, Hideki MORIUCHI
  • Patent number: 10739531
    Abstract: To provide a connector cleaning tool capable of precisely removing dust even on an end surface of a connector having irregularities. The connector cleaning tool includes a buffer body, and an adhesive body arranged with the buffer body, in which in a case where the connector cleaning tool is pressed toward a connection end surface of a connector on which a guide pin is protrudingly provided, the guide pin is inserted into the buffer body via the adhesive body.
    Type: Grant
    Filed: September 14, 2016
    Date of Patent: August 11, 2020
    Assignee: TOMOEGAWA CO., LTD.
    Inventors: Mitsuyoshi Takanashi, Nobuhiro Hashimoto, Yoshihiro Goto, Masayoshi Suzuki, Makoto Goto
  • Patent number: 10739501
    Abstract: Provided is a light diffusion film laminate for a reflective display device which is capable of reducing the change in the brightness of the image without reducing the visibility not only from a predetermined observation position (for example, the front direction of the screen), but also from a slightly inclined direction from the predetermined observation position (for example, the front direction of the screen), thereby having excellent display characteristics, and a reflective display device including the light diffusion film laminate.
    Type: Grant
    Filed: August 14, 2017
    Date of Patent: August 11, 2020
    Assignee: TOMOEGAWA CO., LTD.
    Inventors: Makoto Murata, Hiroto Katagiri
  • Publication number: 20200251234
    Abstract: A radiation shielding sheet includes a fiber and a granular radiation shielding material, in which the fiber and the radiation shielding material are integrally formed into the shape of a sheet.
    Type: Application
    Filed: February 11, 2020
    Publication date: August 6, 2020
    Applicants: TOPPAN PRINTING CO., LTD., TOMOEGAWA CO., LTD.
    Inventors: Masaru HAYAKAWA, Minoru TSUCHIDA
  • Patent number: 10670788
    Abstract: Provided is a light diffusion film laminate for a reflective display device that can improve the reflection luminance at a predetermined observation position (for example, the front direction of the screen) without reducing the visibility not only from the predetermined observation position (for example, the front direction of the screen) but also from a position away from a predetermined observation position (for example, an oblique direction deviated from the front of the screen) and a reflective display device including the light diffusion film laminate. A light diffusion film laminate for a reflective display device has optical diffusibility that changes depending on an incident angle of light, and at least transmits reflected light occurring when incident light is reflected by a reflective layer.
    Type: Grant
    Filed: July 24, 2017
    Date of Patent: June 2, 2020
    Assignee: TOMOEGAWA CO., LTD.
    Inventors: Tsubasa Sakano, Masahide Sugiyama
  • Patent number: 10636551
    Abstract: An object of the present invention to provide a resistor element which can be mounted at a higher density and can cope with a wide range of resistance values, the present invention provides a resistor element including a resistor which mainly contains metal fibers, electrodes which are formed at an end portion of the resistor, and an insulating layer which is in contact with the resistor and the electrodes.
    Type: Grant
    Filed: January 11, 2018
    Date of Patent: April 28, 2020
    Assignee: Tomoegawa Co., Ltd.
    Inventors: Katsuya Okumura, Kazuhiro Eguchi, Daisuke Muramatsu
  • Patent number: 10622113
    Abstract: A radiation shielding sheet of the present invention includes a fiber and a granular radiation shielding material, in which the fiber and the radiation shielding material are integrally formed into the shape of a sheet.
    Type: Grant
    Filed: August 18, 2014
    Date of Patent: April 14, 2020
    Assignees: TOPPAN PRINTING CO., LTD., TOMOEGAWA CO., LTD.
    Inventors: Masaru Hayakawa, Minoru Tsuchida
  • Patent number: 10568201
    Abstract: A multilayer printed wiring board has excellent high-frequency characteristics. The multilayer printed wiring board includes one or more conductive layers and one or more insulating layers. In the multilayer printed wiring board, the one or more conductive layers and the one or more insulating layers are alternately stacked. Each insulating layer of the one or more insulating layers includes one or more of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer. At least one insulating layer of the one or more insulating layers includes a polyolefin resin layer.
    Type: Grant
    Filed: January 24, 2017
    Date of Patent: February 18, 2020
    Assignees: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., TOMOEGAWA CO., LTD.
    Inventors: Hiroaki Takahashi, Tomoyuki Aoki, Kiyotaka Komori, Jun Tochihira, Ryu Harada
  • Patent number: 10471754
    Abstract: Provided is a thermal transfer image receiving sheet that is thin, resistant to curling, has favorable image quality and has opacity. A thermal transfer image receiving sheet of the present invention at least comprises an ink receiving layer, a first support, an adhesive layer and a second support laminated in that order, wherein the first support and the second support are provided with a foamed layer and a non-foamed skin layer laminated on both sides of the foamed layer.
    Type: Grant
    Filed: March 9, 2018
    Date of Patent: November 12, 2019
    Assignee: Tomoegawa Co., Ltd.
    Inventors: Hideaki Takahashi, Shigeki Asai
  • Patent number: 10330831
    Abstract: Provided is an anisotropic optical film, which can, while keeping excellent display characteristics (e.g., brightness and contrast) in the direction of a viewing angle, suppress decreased display characteristics in the other directions, when the anisotropic optical film is used as a diffusion film of a display panel.
    Type: Grant
    Filed: January 16, 2015
    Date of Patent: June 25, 2019
    Assignee: Tomoegawa Co., Ltd.
    Inventors: Masahide Sugiyama, Hiroto Katagiri, Hiroyuki Abe, Tsubasa Sakano
  • Publication number: 20190061320
    Abstract: A resin-clad metal foil which enables a reduction in fluidity of a resin during molding and a reduction in extrusion of the resin while maintaining good adhesiveness, bendability, thermal resistance, and circuit filling property. A first insulating layer includes a polyimide resin layer, a polyamideimide resin layer, a liquid crystal polymer resin layer, a fluororesin layer, or a polyphenylene ether resin layer and a second insulating layer includes a polyolefin resin layer in a semi-cured state are disposed in this order on a metal foil. The polyolefin resin layer contains a component representing a polyolefin-based elastomer and a component representing a thermosetting resin. The percentage by mass of the component in the polyolefin resin layer ranges from 50 wt. % to 95 wt. %.
    Type: Application
    Filed: January 24, 2017
    Publication date: February 28, 2019
    Applicants: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO. LTD., TOMOEGAWA CO., LTD.
    Inventors: Yohsuke ISHIKAWA, Yoshiaki ESAKI, Takayoshi OZEKI, Jun TOCHIHIRA, Ryu HARADA
  • Publication number: 20180376579
    Abstract: A multilayer printed wiring board has excellent high-frequency characteristics. The multilayer printed wiring board includes one or more conductive layers and one or more insulating layers. In the multilayer printed wiring board, the one or more conductive layers and the one or more insulating layers are alternately stacked. Each insulating layer of the one or more insulating layers includes one or more of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer. At least one insulating layer of the one or more insulating layers includes a polyolefin resin layer.
    Type: Application
    Filed: January 24, 2017
    Publication date: December 27, 2018
    Applicants: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., TOMOEGAWA CO., LTD.
    Inventors: Hiroaki TAKAHASHI, Tomoyuki AOKI, Kiyotaka KOMORI, Jun TOCHIHIRA, Ryu HARADA
  • Publication number: 20180270945
    Abstract: A multilayer printed wiring board including one or more insulating layers and at least one conductive layer which are stacked alternately is disclosed. The one or more insulating layers include at least one liquid crystal polymer resin layer so that each of the one or more insulating layers includes at least one layer selected from a group consisting of at least one polyolefin resin layer and the at least one liquid crystal polymer resin layer. A percentage by volume of the at least one liquid crystal polymer resin layer relative to the one or more insulating layers is within a range of 5 to 90%.
    Type: Application
    Filed: January 5, 2016
    Publication date: September 20, 2018
    Applicants: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., TOMOEGAWA CO., LTD.
    Inventors: Hiroaki TAKAHASHI, Kiyotaka KOMORI, Masaya KOYAMA, Jun TOCHIHIRA, Ryu HARADA
  • Publication number: 20180258324
    Abstract: This thermosetting adhesive composition contains as a component (A) a vinyl compound in which a terminal end of a bifunctional polyphenylene ether oligomer is converted to a vinyl group, as a component (B) a maleimide resin, and as a component (C) a thermoplastic elastomer, the equivalent ratio of vinyl groups in the component (A) and maleimide groups in the component (B) being 1.0:0.5 to 1.0:4.0, the proportion of the component (C) in the total weight of the component (A), the component (B), and the component (C) being 55 to 95% by weight, the ratio of styrene units of the component (C) with respect to the total weight of the component (C) being 10 to 40% by weight, the tensile stress at 100% elongation being 0.1 to 2.9 MPa, and the elongation at break being 100% or greater.
    Type: Application
    Filed: January 19, 2016
    Publication date: September 13, 2018
    Applicants: Tomoegawa Co., Ltd., Tomoegawa Co., Ltd.
    Inventors: Jun Tochihira, Ryu Harada