Abstract: A see-through and stir-through lid is provided for cookware. The lid includes a transparent main body having an outer periphery. An access port extends through the main body with a splatter guard secured within the access port. The splatter guard has a self-regulating opening of variable size allowing passage of a working end of a cooking utensil through the opening in the splatter guard while minimizing size of the opening about a shaft of the cooking utensil. A support structure supports a cooking utensil atop the lid with the working end resting above the splatter guard so that liquid and/or food residue may drain through the opening in the splatter guard into the cookware.

Abstract: A see-through and stir-through lid is provided for cookware. The lid includes a transparent main body having an outer periphery. An access port extends through the main body with a splatter guard secured within the access port. The splatter guard has a self-regulating opening of variable size allowing passage of a working end of a cooking utensil through the opening in the splatter guard while minimizing size of the opening about a shaft of the cooking utensil. A support structure supports a cooking utensil atop the lid with the working end resting above the splatter guard so that liquid and/or food residue may drain through the opening in the splatter guard into the cookware.

Abstract: A low loss circuit board sheet includes a first layer disposed on a second layer. The first layer includes a thermosetting adhesive composition and the second layer is selected from a woven fabric substrate impregnated with at least one rubber, a nonwoven fabric substrate impregnated with at least one rubber and a polymeric film having at least one rubber disposed thereon.

Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.

Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a reinforced fluoropolymer composite and a high-flowing thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.

Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a reinforced fluoropolymer composite and a high-flowing thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.