Patents Assigned to Tonoga, Ltd.
  • Low signal loss bonding ply for multilayer circuit boards
    Publication number: 20030072929
    Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
    Type: Application
    Filed: November 7, 2002
    Publication date: April 17, 2003
    Applicant: TONOGA, LTD
    Inventors: Thomas F. McCarthy, David L. Wynants
  • Low signal loss bonding ply for multilayer circuit boards
    Patent number: 6500529
    Abstract: A process for fabricating a low loss multilayer printed circuit board using a bonding ply comprising a fluoropolymer composite substrate and a thermosetting adhesive composition is disclosed. The fluoropolymer composite comprises at least one fluoropolymer and a substrate selected from woven fabrics, nonwoven fabrics and polymeric films.
    Type: Grant
    Filed: September 14, 2001
    Date of Patent: December 31, 2002
    Assignee: Tonoga, Ltd.
    Inventors: Thomas F. McCarthy, David L. Wynants, Sr.