Patents Assigned to TOPBOUND TECHNOLOGY INC.
  • Publication number: 20130330517
    Abstract: This disclosure concerns a thermoforming cover of portable electronic apparatus, comprising: a first transparent layer, being made by plastic material; a color layer, being printed on the first transparent layer; an adhesive layer, being covered on the color layer; and a second transparent layer, being made by plastic material, and disposed on the adhesive layer; wherein the first transparent layer can be set as substrate, and the color layer, the adhesive layer and the second transparent layer are disposed on the first transparent layer by step, then a thermoforming cover can be manufactured in a mold through thermoforming process.
    Type: Application
    Filed: June 12, 2012
    Publication date: December 12, 2013
    Applicant: TOPBOUND TECHNOLOGY INC.
    Inventor: Shan-Tien Hwang
  • Publication number: 20130322951
    Abstract: The present invention relates to a stylus structure, comprising an outer shell, a touch end, an elastic member, a pen core, and a connecting member, wherein the outer shell consists of a first pen tube, a second pen tube, a pen tip, a clip and a pressing head. The touch end is disposed in the pen tip and connected to the second pen tube, and the touch end is consisted of a conductive layer, a TPU layer and a perforation hole. The elastic member is disposed in the outer shell for connecting the pen core, and the connecting member is connected to the pen core by one end thereof and connected to the pressing head by another end thereof wherein when the pressing head is pressed, the connecting member and the elastic member are driven to push the pen core out of the through hole.
    Type: Application
    Filed: June 4, 2012
    Publication date: December 5, 2013
    Applicant: TOPBOUND TECHNOLOGY INC.
    Inventor: Shan-Tien Hwang
  • Publication number: 20130316114
    Abstract: The present invention relates to a screen protector, comprising: a thin film substrate 21; a coating layer 11, being coated on the top surface of the thin film substrate 21; a plurality of transparent protruding points 211, being formed on the bottom surface of the thin film substrate 21; a print layer 31, being attached to the bottom surface of the thin film substrate 21 and surrounding the plurality of transparent protruding points 211; and an adhesive layer 41, being connected to the print layer 31.
    Type: Application
    Filed: May 24, 2012
    Publication date: November 28, 2013
    Applicant: TOPBOUND TECHNOLOGY INC.
    Inventor: Shan-Tien Hwang