Patents Assigned to Topco Technologies Corp.
  • Method for packaging light-emitting diode
    Patent number: 7871835
    Abstract: Disclosed is a method for packaging an LED by a thermoplastic copolymer. The copolymer is polymerized by 100 parts by weight of an acrylic ester, 0.1 to 30 parts by weight of a hydrogen bond monomer, and 0.1 to 70 parts by weight of a bulky monomer. The copolymer has transparency greater than 90%, thermal resistance greater than 130° C., and moisture absorption less than 0.5 wt %, such that the copolymer may be applied as packaging material for a light emitting device.
    Type: Grant
    Filed: April 3, 2009
    Date of Patent: January 18, 2011
    Assignees: Industrial Technology Research Institute, Topco Technologies Corp.
    Inventors: Shu-Ling Yeh, Ya-Lan Chuang, Pei-Jung Tsai, Chih-Hsiang Lin, Hsin-Ching Kao, Feng-Chih Chang, Tang-Jung Wu
  • METHOD FOR PACKAGING LIGHT-EMITTING DIODE
    Publication number: 20100047936
    Abstract: Disclosed is a method for packaging an LED by a thermoplastic copolymer. The copolymer is polymerized by 100 parts by weight of an acrylic ester, 0.1 to 30 parts by weight of a hydrogen bond monomer, and 0.1 to 70 parts by weight of a bulky monomer. The copolymer has transparency greater than 90%, thermal resistance greater than 130° C., and moisture absorption less than 0.5 wt %, such that the copolymer may be applied as packaging material for a light emitting device.
    Type: Application
    Filed: April 3, 2009
    Publication date: February 25, 2010
    Applicants: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE, Topco Technologies Corp.
    Inventors: Shu-Ling YEH, Ya-Lan CHUANG, Pei-Jung TSAI, Chih-Hsiang LIN, Hsin-Ching KAO, Feng-Chih CHANG, Tang-Jung WU
  • LED packaging structure with aluminum board and an LED lamp with said LED packaging structure
    Publication number: 20090008671
    Abstract: An LED lamp is provided. The LED lamp has an aluminum board, a buffer substrate, at least a LED chip, a metal layer structure, and heat sink. The aluminum board has a cup structure thereon. The buffer substrate is assembled on a bottom surface of the cup structure. The LED chips are assembled on the buffer substrate. The metal layer structure is formed on a bottom surface of the aluminum board. The metal layer structure is composed of solderable materials. The heat sink is connected to the metal layer structure through solder joint.
    Type: Application
    Filed: August 27, 2007
    Publication date: January 8, 2009
    Applicants: Lustrous Technology Ltd., Topco Technologies Corp.
    Inventors: Chia-Chi Liu, Wen-Kuei Tsai