Abstract: An apparatus and method are disclosed for securing a substantially circular wafer comprising a chuck comprising a plurality of tensioning grooves each comprising at least one arcuate bend having a bend radius substantially less than an outer region radius, and a vacuum source interconnected with each of the grooves. When the wafer is placed upon the surface concentric with the chuck centre and the vacuum source applied to the grooves, the wafer is held securely to the surface. Additionally, there is disclosed an apparatus for securing a wafer comprising a chuck and a collar comprising a rigid support and an o-ring, the o-ring having a diameter slightly smaller than the outer perimeter. When the wafer is lowered onto the surface in a position concentric with the check centre, the collar is placed against the upper surface concentric with the perimeter and the vacuum source is applied securing the wafer to the surface.