Patents Assigned to Topconn Electronic (Kunshan) Co., Ltd
-
Patent number: 10804654Abstract: An electrical connector and a transmission wafer thereof are provided. The transmission wafer includes an insulating frame, a plurality of grounding terminals fixed to the insulating frame, and a shielding member disposed on the insulating frame. Each of the grounding terminals includes a middle grounding segment embedded in the insulating frame, a front grounding segment, and a rear grounding segment, the latter two of which respectively extend from two ends of the middle grounding segment in two different directions. The shielding member includes a grounding sheet disposed on the insulating frame and a plurality of elastic arms curvedly extending from the grounding sheet to protrude from the insulating frame. The elastic arms are respectively abutted against portions of the front grounding segments arranged adjacent to the insulating frame.Type: GrantFiled: September 12, 2019Date of Patent: October 13, 2020Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.Inventors: Chih-Wei Chen, Chung-Nan Pao, Yueh-Lin Yang, Yi-Guang Lai, Guo-Cing Chen, Kai Wu
-
Patent number: 10784630Abstract: A female connector and a transmission wafer are provided. The female connector includes a housing and a plurality of transmission wafers inserted into the housing. Each of the transmission wafers includes an insulating frame, a plurality of grounding terminals fixed to the insulating frame, and a first shielding member and a second shielding member respectively disposed on two opposite sides of the insulating frame. In each of the transmission wafers, the second shielding member is disposed on a front end portion of the insulating frame, and the first and second shielding members are electrically connected to the grounding terminals so as to be electrically connected to each other through the grounding terminals. The second shielding member of one of any two adjacent transmission wafers is abutted against and electrically connected to the first shielding member of the other one of the any two adjacent transmission wafers.Type: GrantFiled: September 12, 2019Date of Patent: September 22, 2020Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.Inventors: Chih-Wei Chen, Chung-Nan Pao, Yueh-Lin Yang, Yu-Hsiung Lin, Kai Wu, Yan-Bo Lin
-
Patent number: 10103453Abstract: A carrier module of a cable connector includes a circuit board and a grounding bar disposed on the circuit board. The circuit board includes a first insulating layer, a second insulating layer, and a grounding layer arranged between the first and second insulating layers. The circuit board has a hole formed on a surface thereof and a conductive extension disposed within the hole, and the conductive extension is connected to the grounding layer. The grounding bar includes a base portion and a conductive portion connected to the base portion. The conductive portion is inserted into the hole, and connected to the conductive extension, thereby electrically connecting the grounding bar and the grounding layer of the circuit board. Thus, the carrier module of the instant disclosure is provided with the grounding bar having well grounding performance which is firmly fixed on the circuit board.Type: GrantFiled: August 17, 2016Date of Patent: October 16, 2018Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTDInventors: Chung-Nan Pao, Yu-Hsiung Lin, Yi-Guang Lai, Ming-Chun Hsu, Kai Wu
-
Patent number: 9882306Abstract: A carrier module of a cable connector includes a circuit board and a connecting clip clamping the circuit board. The circuit board has a first surface and a second surface. The connecting clip has a clamping portion and a plurality of positioning arms. The clamping portion has a connecting sheet and two clamping sheets curvedly extended from the connecting sheet. The clamping sheets are respectively abutted against the first and second surfaces. The positioning arms are respectively connected to the clamping sheets and respectively arranged at two opposite sides of the clamping portion. The positioning arms are respectively configured to fix a plurality of cables disposed on the clamping sheets. Thus, the carrier module of the instant disclosure provides a positioning effect for the cables by the connecting clip fixed firmly on the circuit board with good common grounding performance. Besides, the instant disclosure also provides a cable connector.Type: GrantFiled: July 7, 2016Date of Patent: January 30, 2018Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTDInventors: Chung-Nan Pao, Yu-Hsiung Lin, Yi-Guang Lai, Ming-Chun Hsu, Kai Wu
-
Patent number: 9634434Abstract: A differential signal assembly includes two pairs of differential signal wafers arranged in one row. Each differential signal wafer includes a plurality of mating portions arranged in one column and a plurality of mounting portions arranged in one column. In one of the two pairs of differential signal wafers, each differential signal wafer has a grounding pin and an offset grounding pin respectively arranged at two opposite ends of the column of mounting portions thereof, each offset grounding pin has an offset with respect to the corresponding column of mounting portions, the two distal ends of the mounting portions of each differential signal wafer are two signal mounting portions, cooperating with the two signal mounting portions of the other differential signal wafer. Thus, the grounding pin and the offset grounding pin of each differential signal wafer are configured to shield the adjacent signal mounting portions.Type: GrantFiled: August 5, 2016Date of Patent: April 25, 2017Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.Inventors: Chung-Nan Pao, Yu-Feng Ke, Sun-Yu Chou, Wei Wang
-
Patent number: 9214768Abstract: A transmission module of a communication connector includes a plurality of first signal terminals, a plurality of second signal terminals, and a plurality of ground terminals. The terminals are coupling along a coupling direction. Along the coupling direction, the grounding terminals respectively correspond to the first and second terminals, a main portion of each signal terminal is orthogonally projecting to an area of a main portion of the corresponding ground terminal, in which the area is located inside the contour of the main portion. Moreover, the width of the main portion is less than or equal to two times of the width of the main portion of the corresponding signal terminal. Thus, the instant disclosure provides the transmission module with novel type.Type: GrantFiled: December 17, 2013Date of Patent: December 15, 2015Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.Inventors: Chung-Nan Pao, Wei Wang, Sun-Yu Chou
-
Patent number: 9160123Abstract: A communication connector includes an outer casing and a plurality of transmission wafers inserted into the outer casing. The transmission wafers are provided for receiving a mating connector along an inserting direction. Each communication wafer includes at least two terminals in coplanar arrangement, and each terminal has a straight segment. The straight segments of the terminals are respectively arranged in a first acute angle and a second acute angle with respective to the inserting direction, in which the first acute angle is smaller than the second acute angle. Two virtual lines, which are respectively defined by extending from the straight segments along the longitudinal directions thereof, are intersecting to form an angle. The angle is the difference of the first and second acute angles. Thus, the communication connector provided by the instant disclosure is produced easily.Type: GrantFiled: July 21, 2014Date of Patent: October 13, 2015Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.Inventors: Chung-Nan Pao, Wei Wang, Sun-Yu Chou
-
Patent number: 9130314Abstract: A terminal lead frame comprises a frame and a plurality of terminal pairs set in the frame. The frame is a first dielectric material. The terminal pairs include a first terminal and a second terminal. The first terminal and the second terminal include a first and second extensions extending into the frame along with a first path and a second path, respectively. The first path is longer than the second path, wherein the first extension contacts with a second material to form a first area of contact while the second extension has a second area of contact with respect to the second dielectric material. The first area of contact is larger than the second area of contact.Type: GrantFiled: December 12, 2013Date of Patent: September 8, 2015Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.Inventors: Chung-Nan Pao, Xiao-Yin Wang, Yu-Hsiung Lin
-
Patent number: 9077117Abstract: A lead frame assembly includes two lead frames detachably coupled to each other. Each lead frame has an insulating frame, several signal terminals fixed on the insulating frame, and a ground terminal fixed on the insulating frame. One of the ground terminals has a shielding sheet and several groups of elastic arms, and the shielding sheet and the elastic arms are protruding from the corresponding insulating frame; another ground terminal has several shielding portions protruding from the corresponding insulating frame. The ground terminals are contact with each other along a shielding direction, and the groups of elastic arms are respectively abutted against the shielding portions. In a space, which is surroundingly defined by the contour of the shielding sheet extending along the shielding direction, the shielding direction passes through at least one of the shielding sheet, the elastic arms, and the shielding portions.Type: GrantFiled: November 19, 2013Date of Patent: July 7, 2015Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.Inventors: Chung-Nan Pao, Xiaoyin Wang, Yu-Hsiung Lin
-
Publication number: 20150171557Abstract: A transmission module of a communication connector includes a plurality of first signal terminals, a plurality of second signal terminals, and a plurality of ground terminals. The terminals are coupling along a coupling direction. Along the coupling direction, the grounding terminals respectively correspond to the first and second terminals, a main portion of each signal terminal is orthogonally projecting to an area of a main portion of the corresponding ground terminal, in which the area is located inside the contour of the main portion. Moreover, the width of the main portion is less than or equal to two times of the width of the main portion of the corresponding signal terminal. Thus, the instant disclosure provides the transmission module with novel type.Type: ApplicationFiled: December 17, 2013Publication date: June 18, 2015Applicant: Topconn Electronic (Kunshan) Co., LtdInventors: CHUNG-NAN PAO, WEI WANG, SUN-YU CHOU
-
Publication number: 20150079842Abstract: A lead frame assembly includes two lead frames detachably coupled to each other. Each lead frame has an insulating frame, several signal terminals fixed on the insulating frame, and a ground terminal fixed on the insulating frame. One of the ground terminals has a shielding sheet and several groups of elastic arms, and the shielding sheet and the elastic arms are protruding from the corresponding insulating frame; another ground terminal has several shielding portions protruding from the corresponding insulating frame. The ground terminals are contact with each other along a shielding direction, and the groups of elastic arms are respectively abutted against the shielding portions. In a space, which is surroundingly defined by the contour of the shielding sheet extending along the shielding direction, the shielding direction passes through at least one of the shielding sheet, the elastic arms, and the shielding portions.Type: ApplicationFiled: November 19, 2013Publication date: March 19, 2015Applicant: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.Inventors: CHUNG-NAN PAO, XIAOYIN WANG, YU-HSIUNG LIN
-
Publication number: 20150079821Abstract: A terminal lead frame comprises a frame and a plurality of terminal pairs set in the frame. The frame is a first dielectric material. The terminal pairs include a first terminal and a second terminal. The first terminal and the second terminal include a first and second extensions extending into the frame along with a first path and a second path, respectively. The first path is longer than the second path, wherein the first extension contacts with a second material to form a first area of contact while the second extension has a second area of contact with respect to the second dielectric material. The first area of contact is larger than the second area of contact.Type: ApplicationFiled: December 12, 2013Publication date: March 19, 2015Applicant: Topconn Electronic (Kunshan) Co., LtdInventors: CHUNG-NAN PAO, XIAO-YIN WANG, YU-HSIUNG LIN
-
Patent number: D736163Type: GrantFiled: November 21, 2013Date of Patent: August 11, 2015Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.Inventors: Chung-Nan Pao, Xiaoyin Wang, Yu-Hsiung Lin
-
Patent number: D737210Type: GrantFiled: November 21, 2013Date of Patent: August 25, 2015Assignee: TOPCONN ELECTRONIC (KUNSHAN) CO., LTD.Inventors: Chung-Nan Pao, Xiao-Yin Wang, Yu-Hsiung Lin