Patents Assigned to Topflight Corp.
  • Patent number: 4670347
    Abstract: An article of manufacture, and process of producing same, which is utilized for the enhanced attenuation of circuit generated radio frequency and electromagnetic interference, i.e. RFI and EMI. The article of manufacture comprises a centrally disposed silver shielding conductive layer which captures circuit produced electromagnetic radiation and directs same to ground so that it does not affect the environment surrounding the electronic circuitry. The process of producing the article involves the silk screen printing of a silver-solvent compound onto a lower polyester-plastics material thus obviating the need for an adhesive between the silver conductive layer and the lower polyester material. The invention also includes the use of the particular article as a shield for the attenuation of circuit produced radiation.
    Type: Grant
    Filed: March 12, 1986
    Date of Patent: June 2, 1987
    Assignee: Topflight Corp.
    Inventors: Dennis Z. Lasik, Michael F. Roman