Patents Assigned to TopLine Coporation
  • Patent number: 10021779
    Abstract: An apparatus and system for attaining quick response to vibration damping of a printed circuit board (PCB) or other planar surface utilizing a defined travel displacement of a single spherical tungsten (or other material) ball in a single or plurality of sealed spherical chambers in a particle impact damper (PID). The single spherical tungsten (or other material) ball is not weighed down, constrained, encumbered or influenced by other spherical balls within the chamber; accordingly, providing unrestricted freedom for the ball to quickly respond at the first occurrence of excessive vibrational acceleration over 1G. The structure of a single spherical particle within a sealed spherical chamber also provides a path of minimum distance for the ball to travel before colliding with the ceiling or side walls of the PID chamber. A plurality of spherical chambers can be arranged in a variety of patterns within the PID housing such as desired.
    Type: Grant
    Filed: November 28, 2017
    Date of Patent: July 10, 2018
    Assignee: TopLine Coporation
    Inventor: Martin B. Hart