Patents Assigned to Toppan Forms Co., Ltd.
  • Patent number: 11073958
    Abstract: Provided is an antenna device that performs the reading of information via near field wireless communication by using a plurality of antenna patterns, and that has no insensitive area on the touch surface. An antenna device that reads information via near field wireless communication includes an antenna layer 20 that includes a plurality of antenna patterns 21a to 21l arrayed in parallel with one another, wherein at least a part of the antenna patterns 21a to 21l are arranged so as to overlap with one another when the antenna layer 20 is viewed in a plan view.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: July 27, 2021
    Assignees: SHARP KABUSHIKI KAISHA, TOPPAN FORMS CO., LTD.
    Inventors: Shinji Yamagishi, Yasuhiro Sugita, Jean Mugiraneza, Yuki Owashi, Yoshitaka Kawanabe
  • Patent number: 10849231
    Abstract: Provided are a laminate including a silver layer on a substrate, in which the silver layer includes a surface in which Kurtosis of a roughness curve satisfies at least one of Condition (i) the change rate of Kurtosis is greater than or equal to 50% under conditions of a temperature of 85° C. and a relative humidity of 85% after 240 hours have elapsed and Condition (ii) the change rate of Kurtosis is greater than or equal to 200% under conditions of a temperature of 85° C. and a relative humidity of 85% after 480 hours have elapsed, and a circuit board in which an electronic component is mounted on the surface of the laminate through a conductive joint portion.
    Type: Grant
    Filed: March 27, 2014
    Date of Patent: November 24, 2020
    Assignee: TOPPAN FORMS CO., LTD.
    Inventor: Akihito Mori
  • Patent number: 10477679
    Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 ?m or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 ??·cm or less.
    Type: Grant
    Filed: January 8, 2018
    Date of Patent: November 12, 2019
    Assignee: Toppan Forms Co., Ltd.
    Inventors: Kumi Hirose, Takuya Sekiguchi, Nariaki Nawa
  • Patent number: 10303994
    Abstract: A non-contact data receiving/transmitting body is provided which includes an IC chip, a first antenna to which the IC chip is connected, and a second antenna for use as a booster that resonates with the first antenna in a non-contact manner. The first antenna is a ring-shaped antenna having at least three straight portions. The second antenna has a central portion that is bent such that parts of the central portion extend respectively along the three straight portions of the first antenna and are at an angle equal to or greater than 90° to each other. The IC chip is provided on the three straight portions of the first antenna and is connected to the first antenna at the straight portions.
    Type: Grant
    Filed: October 28, 2015
    Date of Patent: May 28, 2019
    Assignee: TOPPAN FORMS CO., LTD.
    Inventors: Norihiro Ooishi, Hitoshi Kagaya, Yoshihiro Mizunuma
  • Patent number: 10162989
    Abstract: A sensing system includes an electronic tag and a reading device that transmits and receives information to and from the electronic tag. The reading device includes a transmission unit that sends an alternating-current radio wave including a high-frequency component and a low-frequency component. The electronic tag does not include a power supply and includes a receiving unit that obtains a power supply voltage from the high-frequency component of the alternating-current radio wave and obtains a clock signal from the low-frequency component and a return unit that maintains a maximum amplitude of the clock signal and sends a combination of information and the clock signal as a return signal. The reading device further includes a processing unit that decodes the return signal sent from the electronic tag on the basis of the clock signal.
    Type: Grant
    Filed: June 29, 2018
    Date of Patent: December 25, 2018
    Assignees: FUJIFILM Corporation, TOPPAN FORMS CO., LTD., THE UNIVERSITY OF TOKYO
    Inventors: Yoshihisa Usami, Takayoshi Yokoyama, Yuki Owashi, Hiroyuki Matsui, Junichi Takeya
  • Publication number: 20180307872
    Abstract: A sensing system includes an electronic tag and a reading device that transmits and receives information to and from the electronic tag. The reading device includes a transmission unit that sends an alternating-current radio wave including a high-frequency component and a low-frequency component. The electronic tag does not include a power supply and includes a receiving unit that obtains a power supply voltage from the high-frequency component of the alternating-current radio wave and obtains a clock signal from the low-frequency component and a return unit that maintains a maximum amplitude of the clock signal and sends a combination of information and the clock signal as a return signal. The reading device further includes a processing unit that decodes the return signal sent from the electronic tag on the basis of the clock signal.
    Type: Application
    Filed: June 29, 2018
    Publication date: October 25, 2018
    Applicants: FUJIFILM Corporation, TOPPAN FORMS CO., LTD., THE UNIVERSITY OF TOKYO
    Inventors: Yoshihisa USAMI, Takayoshi YOKOYAMA, Yuki OWASHI, Hiroyuki MATSUI, Junichi TAKEYA
  • Patent number: 10094609
    Abstract: A refrigerant pack is provided with a refrigerant substance containing water, a precipitating component, a non-precipitating component, and a pH indicator, and is configured such that the precipitating component precipitates when the refrigerant substance freezes and is a component not corresponding to the pH indicator, the non-precipitating component does not precipitate when the refrigerant substance freezes and is a component not corresponding to the pH indicator, a change or the presence/absence of coloring in the pH indicator is reflected before and after freezing, and the refrigerant substance changes in color.
    Type: Grant
    Filed: February 26, 2015
    Date of Patent: October 9, 2018
    Assignee: TOPPAN FORMS CO., LTD.
    Inventors: Nobutaka Ueda, Yasuhiro Tanaka
  • Patent number: 10074818
    Abstract: The transistor includes a gate electrode, an insulating layer, a semiconductor layer, a source electrode, and a drain electrode on a substrate, in which the gate electrode is formed by using silver ?-ketocarboxylate denoted by General Formula (1) described below.
    Type: Grant
    Filed: July 9, 2014
    Date of Patent: September 11, 2018
    Assignees: TOPPAN FORMS CO., LTD., OSAKA UNIVERSITY, THE UNIVERSITY OF TOKYO
    Inventors: Takafumi Matsumoto, Junichi Takeya
  • Patent number: 10040960
    Abstract: There are provided a silver ink composition which is capable of forming metallic silver having sufficient electrical conductivity without carrying out a heat treatment at high temperatures; and a conductor and communication device which are obtained using this silver ink composition.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: August 7, 2018
    Assignee: TOPPAN FORMS CO., LTD.
    Inventors: Takuya Sekiguchi, Keiko Omata
  • Patent number: 9834360
    Abstract: An implement for storage at a constant temperature has two housings (21 and 22) that accommodate heat storage agents. One heat storage agent (41) is irremovably accommodated in one housing (21), and a hook-and-loop fastener (30) for installation in a storage container is provided on the outer surface of the other housing (22).
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: December 5, 2017
    Assignee: TOPPAN FORMS CO., LTD.
    Inventors: Yasuhiro Tanaka, Sho Morita
  • Publication number: 20170236048
    Abstract: A non-contact data receiving/transmitting body is provided which includes an IC chip, a first antenna to which the IC chip is connected, and a second antenna for use as a booster that resonates with the first antenna in a non-contact manner. The first antenna is a ring-shaped antenna having at least three straight portions. The second antenna has a central portion that is bent such that parts of the central portion extend respectively along the three straight portions of the first antenna and are at an angle equal to or greater than 90° to each other. The IC chip is provided on the three straight portions of the first antenna and is connected to the first antenna at the straight portions.
    Type: Application
    Filed: October 28, 2015
    Publication date: August 17, 2017
    Applicant: Toppan Forms Co., Ltd.
    Inventors: Norihiro Ooishi, Hitoshi Kagaya, Yoshihiro Mizunuma
  • Patent number: 9604489
    Abstract: A card enclosed unit has a card mount paper and a support mount paper adhered to each other. The card mount paper includes an upper paper and a lower paper. The card mount paper has a card. The card is separably enclosed in the card mount paper. The card is peelably adhered to support mount paper. A PIN code is indicated on the support mount paper side adhesion surface of the card, and a POS code is indicated on the support mount paper side adhesion surface of the card mount paper. The card mount paper has a hole such that the hole is facing the POS code.
    Type: Grant
    Filed: November 27, 2013
    Date of Patent: March 28, 2017
    Assignee: TOPPAN FORMS CO., LTD
    Inventors: Shogo Nakagawa, Norifumi Aizawa, Nobuyuki Saitou
  • Patent number: 9371465
    Abstract: A silver ink composition Which includes a silver carboxylate having a group represented by a formula iCOOAg, an aliphatic primary amine or secondary amine having 2 to 10 carbon atoms, an acetylene alcohol represented by a general formula (2) shown below, and a hydrocarbon having 6 to 20 carbon atoms, and has a viscosity at 27° C. of 40 mPa-s or less, in the formula, each of R? and R? independently represents an alkyl group having 1 to 20 carbon atoms or a phenyl group in which one or more hydrogen atoms may be substituted with a substituent.
    Type: Grant
    Filed: January 25, 2013
    Date of Patent: June 21, 2016
    Assignee: Toppan Forms Co., Ltd.
    Inventors: Kumi Hirose, Marina Imai
  • Patent number: 9328254
    Abstract: There is provided with a silver ink composition which is formed by blending one or more kinds of silver ?-ketocarboxylates selected from the group consisting of silver isobutyrylacetate, silver benzoylacetate, silver propionylacetate, silver acetoacetate, silver ?-methylacetoacetate, and silver ?-ethylacetoacetate, and an aliphatic primary or secondary amine having 1 to 10 carbon atoms, and a substrate with a surface on which a metallic silver layer which is formed by heating the silver ink composition is provided. According to the invention, it is possible to obtain a silver ink composition suitable for forming a metallic silver layer which has superior glossiness and specularity, and a substrate with a surface on which a metallic silver layer is formed using the silver ink composition.
    Type: Grant
    Filed: July 27, 2011
    Date of Patent: May 3, 2016
    Assignee: TOPPAN FORMS CO., LTD.
    Inventor: Takafumi Matsumoto
  • Publication number: 20150259557
    Abstract: There are provided a silver ink composition which is capable of forming metallic silver having sufficient electrical conductivity without carrying out a heat treatment at high temperatures; and a conductor and communication device which are obtained using this silver ink composition.
    Type: Application
    Filed: September 27, 2013
    Publication date: September 17, 2015
    Applicant: TOPPAN FORMS CO., LTD
    Inventors: Takuya Sekiguchi, Keiko Omata
  • Publication number: 20150008376
    Abstract: A silver ink composition which includes a silver carboxylate having a group represented by a formula —COOAg, an aliphatic primary amine or secondary amine having 2 to 10 carbon atoms, an acetylene alcohol represented by a general formula (2) shown below, and a hydrocarbon having 6 to 20 carbon atoms, and has a viscosity at 27° C. of 40 mPa·s or less, (In the formula, each of R? and R? independently represents an alkyl group having 1 to 20 carbon atoms or a phenyl group in which one or more hydrogen atoms may be substituted with a substituent.
    Type: Application
    Filed: January 25, 2013
    Publication date: January 8, 2015
    Applicant: Toppan Forms Co., LTD
    Inventors: Kumi Hirose, Marina Imai
  • Patent number: 8603863
    Abstract: This IC card is provided with a module having an inlet, an adhesive layer covering the module, and a first base material and second base material sandwiching the module with interposition of the adhesive layer. The module is disposed on one face of the first base material with interposition of a viscous layer which has a thickness that varies according to the thickness at each area of the module, and its two ends are narrower than its other parts when viewed from the outer face side of the first base material or the outer face side of the second base material. According to this IC card, it is possible to offer the IC card with a flat surface, and without occurrence of strain in the embedded IC chip.
    Type: Grant
    Filed: February 24, 2012
    Date of Patent: December 10, 2013
    Assignee: Toppan Forms Co., Ltd.
    Inventors: Takahiro Sakurai, Yuichi Ito
  • Publication number: 20130121872
    Abstract: There is provided with a silver ink composition which is formed by blending one or more kinds of silver ?-ketocarboxylates selected from the group consisting of silver isobutyrylacetate, silver benzoylacetate, silver propionylacetate, silver acetoacetate, silver ?-methylacetoacetate, and silver ?-ethylacetoacetate, and an aliphatic primary or secondary amine having 1 to 10 carbon atoms, and a substrate with a surface on which a metallic silver layer which is formed by heating the silver ink composition is provided. According to the invention, it is possible to obtain a silver ink composition suitable for forming a metallic silver layer which has superior glossiness and specularity, and a substrate with a surface on which a metallic silver layer is formed using the silver ink composition.
    Type: Application
    Filed: July 27, 2011
    Publication date: May 16, 2013
    Applicant: Toppan Forms Co., Ltd.
    Inventor: Takafumi Matsumoto
  • Patent number: 8208262
    Abstract: The window base material of the present invention is provided with an intermediate layer having a window section composed of transparent resin and a colored section composed of colored resin surrounding the window section, and a transparent first base material and second base material which sandwich the intermediate layer. The card with embedded module of the present invention is provided with a module having a display element, an adhesive layer covering the module, and a paired third base material and fourth base material which sandwich the module with interposition of the adhesive layer, wherein the third base material is composed of the window base material, and the display section of the display element is disposed so as to face the window section of the window base material.
    Type: Grant
    Filed: November 7, 2007
    Date of Patent: June 26, 2012
    Assignee: Toppan Forms Co., Ltd.
    Inventors: Takahiro Sakurai, Yuichi Ito
  • Publication number: 20120156831
    Abstract: This IC card is provided with a module having an inlet, an adhesive layer covering the module, and a first base material and second base material sandwiching the module with interposition of the adhesive layer. The module is disposed on one face of the first base material with interposition of a viscous layer which has a thickness that varies according to the thickness at each area of the module, and its two ends are narrower than its other parts when viewed from the outer face side of the first base material or the outer face side of the second base material. According to this IC card, it is possible to offer the IC card with a flat surface, and without occurrence of strain in the embedded IC chip.
    Type: Application
    Filed: February 24, 2012
    Publication date: June 21, 2012
    Applicant: TOPPAN FORMS CO., LTD.
    Inventors: Takahiro SAKURAI, Yuichi ITO