Patents Assigned to Toppan Forms Co., Ltd.
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Patent number: 11073958Abstract: Provided is an antenna device that performs the reading of information via near field wireless communication by using a plurality of antenna patterns, and that has no insensitive area on the touch surface. An antenna device that reads information via near field wireless communication includes an antenna layer 20 that includes a plurality of antenna patterns 21a to 21l arrayed in parallel with one another, wherein at least a part of the antenna patterns 21a to 21l are arranged so as to overlap with one another when the antenna layer 20 is viewed in a plan view.Type: GrantFiled: January 27, 2017Date of Patent: July 27, 2021Assignees: SHARP KABUSHIKI KAISHA, TOPPAN FORMS CO., LTD.Inventors: Shinji Yamagishi, Yasuhiro Sugita, Jean Mugiraneza, Yuki Owashi, Yoshitaka Kawanabe
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Patent number: 10849231Abstract: Provided are a laminate including a silver layer on a substrate, in which the silver layer includes a surface in which Kurtosis of a roughness curve satisfies at least one of Condition (i) the change rate of Kurtosis is greater than or equal to 50% under conditions of a temperature of 85° C. and a relative humidity of 85% after 240 hours have elapsed and Condition (ii) the change rate of Kurtosis is greater than or equal to 200% under conditions of a temperature of 85° C. and a relative humidity of 85% after 480 hours have elapsed, and a circuit board in which an electronic component is mounted on the surface of the laminate through a conductive joint portion.Type: GrantFiled: March 27, 2014Date of Patent: November 24, 2020Assignee: TOPPAN FORMS CO., LTD.Inventor: Akihito Mori
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Patent number: 10477679Abstract: A wiring board includes: thin silver wires formed on a substrate by a printing method, in which the thin silver wires are configured so that the width thereof in a cross-section in a direction perpendicular to a wire length direction thereof is 20 ?m or less, a top thereof has a smaller width than that of a contact portion that comes into contact with the substrate, and a volume resistivity of the thin silver wire is 15 ??·cm or less.Type: GrantFiled: January 8, 2018Date of Patent: November 12, 2019Assignee: Toppan Forms Co., Ltd.Inventors: Kumi Hirose, Takuya Sekiguchi, Nariaki Nawa
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Patent number: 10303994Abstract: A non-contact data receiving/transmitting body is provided which includes an IC chip, a first antenna to which the IC chip is connected, and a second antenna for use as a booster that resonates with the first antenna in a non-contact manner. The first antenna is a ring-shaped antenna having at least three straight portions. The second antenna has a central portion that is bent such that parts of the central portion extend respectively along the three straight portions of the first antenna and are at an angle equal to or greater than 90° to each other. The IC chip is provided on the three straight portions of the first antenna and is connected to the first antenna at the straight portions.Type: GrantFiled: October 28, 2015Date of Patent: May 28, 2019Assignee: TOPPAN FORMS CO., LTD.Inventors: Norihiro Ooishi, Hitoshi Kagaya, Yoshihiro Mizunuma
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Patent number: 10162989Abstract: A sensing system includes an electronic tag and a reading device that transmits and receives information to and from the electronic tag. The reading device includes a transmission unit that sends an alternating-current radio wave including a high-frequency component and a low-frequency component. The electronic tag does not include a power supply and includes a receiving unit that obtains a power supply voltage from the high-frequency component of the alternating-current radio wave and obtains a clock signal from the low-frequency component and a return unit that maintains a maximum amplitude of the clock signal and sends a combination of information and the clock signal as a return signal. The reading device further includes a processing unit that decodes the return signal sent from the electronic tag on the basis of the clock signal.Type: GrantFiled: June 29, 2018Date of Patent: December 25, 2018Assignees: FUJIFILM Corporation, TOPPAN FORMS CO., LTD., THE UNIVERSITY OF TOKYOInventors: Yoshihisa Usami, Takayoshi Yokoyama, Yuki Owashi, Hiroyuki Matsui, Junichi Takeya
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Publication number: 20180307872Abstract: A sensing system includes an electronic tag and a reading device that transmits and receives information to and from the electronic tag. The reading device includes a transmission unit that sends an alternating-current radio wave including a high-frequency component and a low-frequency component. The electronic tag does not include a power supply and includes a receiving unit that obtains a power supply voltage from the high-frequency component of the alternating-current radio wave and obtains a clock signal from the low-frequency component and a return unit that maintains a maximum amplitude of the clock signal and sends a combination of information and the clock signal as a return signal. The reading device further includes a processing unit that decodes the return signal sent from the electronic tag on the basis of the clock signal.Type: ApplicationFiled: June 29, 2018Publication date: October 25, 2018Applicants: FUJIFILM Corporation, TOPPAN FORMS CO., LTD., THE UNIVERSITY OF TOKYOInventors: Yoshihisa USAMI, Takayoshi YOKOYAMA, Yuki OWASHI, Hiroyuki MATSUI, Junichi TAKEYA
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Patent number: 10094609Abstract: A refrigerant pack is provided with a refrigerant substance containing water, a precipitating component, a non-precipitating component, and a pH indicator, and is configured such that the precipitating component precipitates when the refrigerant substance freezes and is a component not corresponding to the pH indicator, the non-precipitating component does not precipitate when the refrigerant substance freezes and is a component not corresponding to the pH indicator, a change or the presence/absence of coloring in the pH indicator is reflected before and after freezing, and the refrigerant substance changes in color.Type: GrantFiled: February 26, 2015Date of Patent: October 9, 2018Assignee: TOPPAN FORMS CO., LTD.Inventors: Nobutaka Ueda, Yasuhiro Tanaka
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Patent number: 10074818Abstract: The transistor includes a gate electrode, an insulating layer, a semiconductor layer, a source electrode, and a drain electrode on a substrate, in which the gate electrode is formed by using silver ?-ketocarboxylate denoted by General Formula (1) described below.Type: GrantFiled: July 9, 2014Date of Patent: September 11, 2018Assignees: TOPPAN FORMS CO., LTD., OSAKA UNIVERSITY, THE UNIVERSITY OF TOKYOInventors: Takafumi Matsumoto, Junichi Takeya
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Patent number: 10040960Abstract: There are provided a silver ink composition which is capable of forming metallic silver having sufficient electrical conductivity without carrying out a heat treatment at high temperatures; and a conductor and communication device which are obtained using this silver ink composition.Type: GrantFiled: September 27, 2013Date of Patent: August 7, 2018Assignee: TOPPAN FORMS CO., LTD.Inventors: Takuya Sekiguchi, Keiko Omata
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Patent number: 9834360Abstract: An implement for storage at a constant temperature has two housings (21 and 22) that accommodate heat storage agents. One heat storage agent (41) is irremovably accommodated in one housing (21), and a hook-and-loop fastener (30) for installation in a storage container is provided on the outer surface of the other housing (22).Type: GrantFiled: January 9, 2013Date of Patent: December 5, 2017Assignee: TOPPAN FORMS CO., LTD.Inventors: Yasuhiro Tanaka, Sho Morita
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Publication number: 20170236048Abstract: A non-contact data receiving/transmitting body is provided which includes an IC chip, a first antenna to which the IC chip is connected, and a second antenna for use as a booster that resonates with the first antenna in a non-contact manner. The first antenna is a ring-shaped antenna having at least three straight portions. The second antenna has a central portion that is bent such that parts of the central portion extend respectively along the three straight portions of the first antenna and are at an angle equal to or greater than 90° to each other. The IC chip is provided on the three straight portions of the first antenna and is connected to the first antenna at the straight portions.Type: ApplicationFiled: October 28, 2015Publication date: August 17, 2017Applicant: Toppan Forms Co., Ltd.Inventors: Norihiro Ooishi, Hitoshi Kagaya, Yoshihiro Mizunuma
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Patent number: 9604489Abstract: A card enclosed unit has a card mount paper and a support mount paper adhered to each other. The card mount paper includes an upper paper and a lower paper. The card mount paper has a card. The card is separably enclosed in the card mount paper. The card is peelably adhered to support mount paper. A PIN code is indicated on the support mount paper side adhesion surface of the card, and a POS code is indicated on the support mount paper side adhesion surface of the card mount paper. The card mount paper has a hole such that the hole is facing the POS code.Type: GrantFiled: November 27, 2013Date of Patent: March 28, 2017Assignee: TOPPAN FORMS CO., LTDInventors: Shogo Nakagawa, Norifumi Aizawa, Nobuyuki Saitou
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Patent number: 9371465Abstract: A silver ink composition Which includes a silver carboxylate having a group represented by a formula iCOOAg, an aliphatic primary amine or secondary amine having 2 to 10 carbon atoms, an acetylene alcohol represented by a general formula (2) shown below, and a hydrocarbon having 6 to 20 carbon atoms, and has a viscosity at 27° C. of 40 mPa-s or less, in the formula, each of R? and R? independently represents an alkyl group having 1 to 20 carbon atoms or a phenyl group in which one or more hydrogen atoms may be substituted with a substituent.Type: GrantFiled: January 25, 2013Date of Patent: June 21, 2016Assignee: Toppan Forms Co., Ltd.Inventors: Kumi Hirose, Marina Imai
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Patent number: 9328254Abstract: There is provided with a silver ink composition which is formed by blending one or more kinds of silver ?-ketocarboxylates selected from the group consisting of silver isobutyrylacetate, silver benzoylacetate, silver propionylacetate, silver acetoacetate, silver ?-methylacetoacetate, and silver ?-ethylacetoacetate, and an aliphatic primary or secondary amine having 1 to 10 carbon atoms, and a substrate with a surface on which a metallic silver layer which is formed by heating the silver ink composition is provided. According to the invention, it is possible to obtain a silver ink composition suitable for forming a metallic silver layer which has superior glossiness and specularity, and a substrate with a surface on which a metallic silver layer is formed using the silver ink composition.Type: GrantFiled: July 27, 2011Date of Patent: May 3, 2016Assignee: TOPPAN FORMS CO., LTD.Inventor: Takafumi Matsumoto
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Publication number: 20150259557Abstract: There are provided a silver ink composition which is capable of forming metallic silver having sufficient electrical conductivity without carrying out a heat treatment at high temperatures; and a conductor and communication device which are obtained using this silver ink composition.Type: ApplicationFiled: September 27, 2013Publication date: September 17, 2015Applicant: TOPPAN FORMS CO., LTDInventors: Takuya Sekiguchi, Keiko Omata
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Publication number: 20150008376Abstract: A silver ink composition which includes a silver carboxylate having a group represented by a formula —COOAg, an aliphatic primary amine or secondary amine having 2 to 10 carbon atoms, an acetylene alcohol represented by a general formula (2) shown below, and a hydrocarbon having 6 to 20 carbon atoms, and has a viscosity at 27° C. of 40 mPa·s or less, (In the formula, each of R? and R? independently represents an alkyl group having 1 to 20 carbon atoms or a phenyl group in which one or more hydrogen atoms may be substituted with a substituent.Type: ApplicationFiled: January 25, 2013Publication date: January 8, 2015Applicant: Toppan Forms Co., LTDInventors: Kumi Hirose, Marina Imai
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Patent number: 8603863Abstract: This IC card is provided with a module having an inlet, an adhesive layer covering the module, and a first base material and second base material sandwiching the module with interposition of the adhesive layer. The module is disposed on one face of the first base material with interposition of a viscous layer which has a thickness that varies according to the thickness at each area of the module, and its two ends are narrower than its other parts when viewed from the outer face side of the first base material or the outer face side of the second base material. According to this IC card, it is possible to offer the IC card with a flat surface, and without occurrence of strain in the embedded IC chip.Type: GrantFiled: February 24, 2012Date of Patent: December 10, 2013Assignee: Toppan Forms Co., Ltd.Inventors: Takahiro Sakurai, Yuichi Ito
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Publication number: 20130121872Abstract: There is provided with a silver ink composition which is formed by blending one or more kinds of silver ?-ketocarboxylates selected from the group consisting of silver isobutyrylacetate, silver benzoylacetate, silver propionylacetate, silver acetoacetate, silver ?-methylacetoacetate, and silver ?-ethylacetoacetate, and an aliphatic primary or secondary amine having 1 to 10 carbon atoms, and a substrate with a surface on which a metallic silver layer which is formed by heating the silver ink composition is provided. According to the invention, it is possible to obtain a silver ink composition suitable for forming a metallic silver layer which has superior glossiness and specularity, and a substrate with a surface on which a metallic silver layer is formed using the silver ink composition.Type: ApplicationFiled: July 27, 2011Publication date: May 16, 2013Applicant: Toppan Forms Co., Ltd.Inventor: Takafumi Matsumoto
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Patent number: 8208262Abstract: The window base material of the present invention is provided with an intermediate layer having a window section composed of transparent resin and a colored section composed of colored resin surrounding the window section, and a transparent first base material and second base material which sandwich the intermediate layer. The card with embedded module of the present invention is provided with a module having a display element, an adhesive layer covering the module, and a paired third base material and fourth base material which sandwich the module with interposition of the adhesive layer, wherein the third base material is composed of the window base material, and the display section of the display element is disposed so as to face the window section of the window base material.Type: GrantFiled: November 7, 2007Date of Patent: June 26, 2012Assignee: Toppan Forms Co., Ltd.Inventors: Takahiro Sakurai, Yuichi Ito
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Publication number: 20120156831Abstract: This IC card is provided with a module having an inlet, an adhesive layer covering the module, and a first base material and second base material sandwiching the module with interposition of the adhesive layer. The module is disposed on one face of the first base material with interposition of a viscous layer which has a thickness that varies according to the thickness at each area of the module, and its two ends are narrower than its other parts when viewed from the outer face side of the first base material or the outer face side of the second base material. According to this IC card, it is possible to offer the IC card with a flat surface, and without occurrence of strain in the embedded IC chip.Type: ApplicationFiled: February 24, 2012Publication date: June 21, 2012Applicant: TOPPAN FORMS CO., LTD.Inventors: Takahiro SAKURAI, Yuichi ITO