Abstract: Provided is a non-contact ID card which is superior in the productivity and the electrical properties, and a method capable of manufacturing such non-contact ID card. The non-contact ID card of the present invention is characterized in that the non-contact ID card comprises an antenna circuit board in which an antenna is formed on a substrate and an interposer board in which an enlarged electrode, which is connected to an electrode of an IC chip, is formed on a substrate on which the IC chip is mounted. The non-contact ID card is formed by laminating both boards in such a manner that the electrode of the antenna and the enlarged electrode are bonded, in which both electrodes are adhesively bonded by an insulating adhesive filled in minute recesses dispersed on bonding faces of the electrode of the antenna and/or the enlarged electrode.

Abstract: A low-cost non-contact ID card having practical electrical properties and the like is disclosed. The non-contact ID card comprises an antenna circuit board wherein an antenna is formed on a substrate and an interposer board wherein an enlarged electrode is formed on a substrate that is mounted with an IC chip. The enlarged electrode is connected to an electrode of the IC chip. The antenna circuit board and the interposer board are joined in such a manner that an electrode of the antenna is in direct contact with the enlarged electrode which is a resin electrode made of a conductive resin containing a thermoplastic resin.

Abstract: Laminates for electronic components are produced by applying a polyimide resin precursor solution containing a palladium compound on a polyimide substrate, drying the resulting coating to form a polyimide resin precursor layer, irradiating this layer with ultraviolet rays in the presence of a hydrogen donor to form nuclei for primer plating, forming a metal primer layer by electroless plating, and converting the polyimide resin precursor layer into a polyimide resin layer through imidation by heating either after or before the formation of a surface plating layer. The invention provides laminates for electronic components which are extremely improved in adhesion to metal layers without impairing the characteristics inherent in the substrate and are excellent in insulating properties, and polyimide resin precursor resin solution to be used in the production of the laminates.

Abstract: A method accurately calibrating a movement control system of mark recognition in a chip mounting device, comprising the steps of: recognizing a first recognition mark put on a head (2) and a second recognition mark (13) put on a stage (26) with two-field recognition means (7) so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7); and, with the head (2) lowered to position the first recognition mark closely to the second recognition mark (13), recognizing both marks with third recognition means (20) when the two-field recognition means (7) is moved back so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7).

Abstract: A noncontact ID card composed by laminating an antenna circuit board where an antenna is formed and an interposer board formed by connecting an enlarged electrode to an electrode of a mounted IC chip and bonding between an antenna electrode of the antenna circuit board and the enlarged electrode of the interposer board with electroconductive adhesive material, wherein a substrate of the antenna circuit board and a substrate of the interposer board are bonded. In addition, in another composition, at least one local deformation is applied to a boding face of the electrodes each other in a direction crossing the bonding face.

Abstract: A method of manufacturing a COF package comprises the steps of providing a resin film substrate with a hole for receiving a chip, providing an IC chip having electrodes, inserting the IC chip into the hole so as to fix it with its electrodes exposed above the substrate surface, and forming a circuit pattern on the substrate surface for connection with the electrodes. The hole and the IC chip are tapered, and the IC chip is secured in the hole with sealant or adhesive.

Abstract: A resin-encapsulation method of the present invention for electronic parts by a stencil printing, in which a resin filling opening in a stencil is filled with a resin while a squeegee is being moved over the stencil, is characterized in that elevation control of the squeegee is made in a finish printing process at a position close to an end portion of the resin filling opening on a squeegee movement terminal side so as to scrape the excess of the filing resin out of the resin filling opening.

Abstract: This noncontact ID card or the like comprises an antenna circuit board having an antenna formed on a substrate and an interposer board having expanded electrodes formed on a substrate where an IC chip is embedded, the expanded electrodes being connected to electrodes of the IC chip, wherein both boards are stacked in such a way that the electrodes of the antenna are joined to the expanded electrodes.

Abstract: There is provided a melt spinning apparatus capable of reducing the unevenness of fineness of a yarn. The nozzles of the spinning plate are arranged annular in at least one circle, and a cylindrical filter is disposed at an exit of a cooling wind in the cooling device so as to enclose around a spun yarn discharged from the spinning plate. The annular diameter of the nozzles is from no less than 0.6 times to no more than one time of the internal diameter of the cylindrical filter, and the flow velocity of the cooling wind blown from the cylindrical filter is distributed gradually higher according to the downstream of the spun yarn.

Abstract: A laser exposure apparatus including a laser oscillator (1) for oscillating laser beam having a circular section, a beam expander (4) for enlarging the laser beam oscillated from the laser oscillator, a square mask (6) for shaping the laser beam having the circular section enlarged by the beam expander into a square section and an optical system for contracting the laser beam formed into the square section by the square mask. Even when a very small identification code is attached to a wafer, the identification code can be marked to improve reading recognizability of the identification code.