Abstract: A process for preparing a silicone compound, the process comprising reacting (A) a silicon compound having silicon-bonded alkoxy groups or silicon-bonded aryloxy groups and (B) a disiloxane in the presence of (C) a carboxylic acid, (D) an acid catalyst, and (E) a carboxylic anhydride, and a process for preparing a silicone compound, the process comprising reacting (F) a silicon compound having silicon-bonded acyloxy groups and (B) a disiloxane compound in the presence of (D) an acid catalyst, (E) a carboxylic anhydride, and (G) an alcohol.

Abstract: Resinous composition comprising: (A) 100 weight parts of (R2SiO2/2)w(RSiO3/2)x(SiO4/2)y(O1/2R1)z wherein R is selected from the group consisting of monovalent hydrocarbon groups having 1 to 10 carbon atoms, R1 is selected from the group consisting of the hydrogen atom and saturated hydrocarbon groups having from 1 to 6 carbon atoms, w is a number from 0 to 0.2, x is a number from 0.4 to 0.9, y is a number from 0.1 to 0.6, z is a number from 0.1 to 0.5, and (w+x+y)=1; (B) 20 to 150 weight parts of an alcohol-based solvent; (C) 100 to 1000 weight parts of a solvent selected from the group consisting of hydrocarbon-based solvents and polydimethylsiloxanes described by the formula Me3SiO(Me2SiO)nSiMe3, wherein Me is the methyl group and n has a value of 0 or 1; (D) 1 to 100 weight parts of a coupling agent selected from the group consisting of alkoxysilanes and silane coupling agents; (E) 0.1 to 20 weight parts of a condensation catalyst, and (F) 0.

Abstract: A silicone gel composition is characterized by excellent storage stability in a non-cured state and by high adhesion to a substrate and long-term stability of consistency at elevated temperatures after curing. The silicone gel composition comprises: a polyorganosiloxane (A), which consists of polyorganosiloxane (A-1) that contains R(CH3)2SiO2/2 units, RsiO3/2 units R(CH3)2SiO1/2 units, and polydiorganosiloxane (A-2) that contains R(CH3)2SiO2/2 units and R(CH3)2SiO1/2 units, and R(CH3) which contains in one molecule two silicon-bonded hydrogen atoms; an addition-reaction platinum catalyst (C); an organosilicon compound (D) selected from silane of the general formula (R1O)nSiR24-n or a partially hydrolyzed condensate thereof; and an organic titanium compound (E).

Abstract: A composition comprises the product obtained by homogeneously blending: (A) 100 parts by weight of a polyorganosiloxane containing at least two alkenyl radicals per molecule, (B) an organohydrogensiloxane containing at least two silicon-bonded hydrogen atoms per molecule in a quantity sufficient to provide from 0.5 to 3 silicon-bonded hydrogen atoms per alkenyl radical of (A), (C) from 50-2000 parts by weight of silver particles pre-treated with an organosilicon compound selected from the group consisting of (i) alkoxy group(s)-containing silanes and (ii) organosiloxanes, (D) a platinum catalyst, (E) up to 20 weight percent based on the weight of (A) of an organosilicon compound containing at least one silicon-bonded alkoxy group per molecule, and (F) from 0.001 to 5 parts by weight per 100 parts by weight of (A) of a cure inhibitor.

Abstract: A viscous liquid vibration damping composition containing (A) 30-95 weight percent of a viscous liquid, and (B) 5-70 weight percent of at least two solid powders having different average particle diameters, where the difference between the respective average particle diameters of the two solid powders is at least 10 &mgr;m. These viscous liquid vibration damping compositions are superior in vibration damping properties, and possess a stable vibration damping characteristic that is not significantly affected by temperature changes.

Abstract: A vibration damping silicone composition with excellent long term storage stability and vibration damping ability contains as components (A) a silicone oil, (B) hollow particles of an organic resin having an inorganic material powder supported on its surfaces, and (C) a solid inorganic material powder.

Abstract: A method for forming an electrically insulating thin film coating the surface of an electronic device with an electrically insulating thin-film-forming resin composition and crosslinking the composition by a method selected from the group consisting of heating and irradiation with high-energy rays.

Abstract: A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials. A method of manufacturing a silicone-based adhesive sheet comprising (i) curing a silicone composition to form a cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxygen atoms and/or sulfur atoms in contact with the silicone composition and the backing materials are releasable from the cured product, and (ii) separating the cured product from the backing materials.

Abstract: An adhesive composition for bonding semiconductor chips to their chip mounting components comprising a curable polymer composition comprising from 1 to 900 weight-ppm spherical filler having an average particle size of from 10 to 100 &mgr;m and a major axis-to-minor axis ratio of from 1 to 1.5. Also, semiconductor devices in which a semiconductor chip therein is bonded to its chip mounting component by the aforesaid adhesive composition.

Abstract: An adhesive composition for bonding of semiconductor chips to their chip mounting components comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 &mgr;m and an aspect ratio of 1 to 1.5. Semiconductor devices according to this invention are characterized in that a semiconductor chip therein is bonded to the mounting component for said chip by the aforementioned adhesive.

Abstract: Water base coating material compositions form coating films of superior flat finish properties. They contain silicone particles with at least two kinds of different average particle size. According to the method of making the composition, a water base coating material composition can be formed by adding an aqueous suspension of silicone particles to a water base coating material composition where the aqueous suspension contains at least two kinds of silicone particles with different average particle size.

Abstract: A water repellent silicone coating agent composition comprising (A) a diorganopolysiloxane having a viscosity of 20 to 20,000 mPa·s at 25° C. in which the terminal ends of the molecular chain are blocked by silanol groups or silicon-bonded hydrolyzable groups, (B) a cross-linking agent represented by general formula RaSiX4-a, in which R is a monovalent hydrocarbon group comprising 1 to 10 carbon atoms, X is a hydrolyzable group, and subscript a is an integer of 0 to 2, (C) a condensation reaction catalyst, (D) a hydrophobic surface treated dry process silica having a carbon content of 3.7 to 5% by weight and a bulk density of 40 to 99 g/L, or a hydrophobic surface treated dry process silica having a carbon content of 2.7 to 5% by weight and a bulk density of 100 to 300 g/L, (E) an organic functional silane coupling agent-based adhesion-imparting agent, (F) an organic solvent, and optionally (G) a non-reactive silicone fluid.

Abstract: A flame-retardant thermoplastic resin composition comprising (A) 100 weight parts of a thermoplastic resin, (B) 10 to 300 weight parts of particulate metal hydroxide; (C) 0.01 to 50 weight parts of a branched polyorganosiloxane having alkoxy groups and described by average unit formula R1a(R2O)bSiO(4−a−b)/2, where R1 and R2 are monovalent hydrocarbon groups selected from the group consisting of alkyl, alkenyl, and aryl groups, a is 0 or a positive number; b is a positive number; and a+b is a number from 0.75 to 2.5; (D) 0.01 to 50 weight parts of a branched polyorganosiloxane having silanol groups and described by average unit formula R3a(HO)bSiO(4−a−b)/2, where R3 is a monovalent hydrocarbon group selected from the group consisting of alkyl, alkenyl, and aryl groups, a is 0 or a positive number, b is a positive number, and a+b is a number from 0.75 to 2.5; and (E) 0.01 to 10 weight parts of a condensation reaction promoting catalyst.

Abstract: A vibration damping silicone composition of superior vibration damping properties and superior long-term storage stability contains (A) a silicone oil, and (B) a silicone resin powder. Component (B) is a solid at room temperature, and has a volatile component content of not more than one percent by weight, after being heated for two hours at 200° C.

Abstract: A semiconductor device having a semiconductor chip; a semiconductor chip attachment element facing the semiconductor chip, at least one interconnect on the surface of the semiconductor chip attachment element; and at least one member consisting of a metal or metal alloy that electrically connects the semiconductor chip with the interconnects; wherein the semiconductor chip is bonded to the semiconductor chip attachment element by an adhesive and at least a portion of at least one member that electrically connects the semiconductor chip with at least one interconnect is sealed or imbedded with a sealant/filling agent, and the complex modulus of at least one of the adhesive and the sealant/filling agent is not greater than 1×108 Pa at −65° C. and a shear frequency of 10 Hz.

Abstract: A vibration damping silicone composition having excellent vibration damping ability and good storage stability contains (A) a silicone oil, (B) calcium carbonate powder, (C) a solid inorganic material powder other than powder (B) having a mean particle size of 20-200 &mgr;m, and (D) a fatty acid or fatty acid derivative.

Abstract: Stable vinyl copolymer emulsions are capable of forming strongly water repellent and highly water resistant films and coatings, and can be used as paint or coating additives. They are highly compatible with paint and coating compositions. The vinyl copolymer emulsions are produced by emulsion polymerizing (A) 50-99.9 weight percent of a vinyl monomer, (B) 0.1-50 weight percent of a branched organosilicon compound bearing a radically polymerizable organic group, where the sum of components (A) and (B) is 100 weight percent, and (C) a radically polymerizable surfactant used at 0.1-20 weight parts per 100 weight parts of the total amount of components (A) and (B).

Abstract: A thermoplastic resin composition comprising (A) 100 weight parts thermoplastic resin, (B) 0.1 to 100 weight parts of a mixture of (b-1) thermoplastic resin and (b-2) polyorganosiloxane that has a viscosity at 25° C. of at least 1,000,000 mPa·s, and (C) 0.1 to 100 weight parts polyorganosiloxane-bonded thermoplastic resin in which (c-1) thermoplastic resin and (c-2) polyorganosiloxane are chemically bonded to each other.

Abstract: A thermoplastic elastomer composition, method of preparation, and article prepared therefrom. The thermoplastic elastomer composition comprising (A) a thermoplastic elastomer, (B) a thermoplastic resin which has Rockwell hardness (R scale) exceeding 80 at 25° C., (C) a polydiorganosiloxane which has a Williams plasticity exceeding 100 at 25° C.; and (D) an inorganic filler.

Abstract: A thermoconductive liquid silicone rubber composition is provided for fixing rolls. The composition is capable of producing silicone rubber of superior thermal conductivity and small compression set after curing. The thermoconductive liquid silicone rubber composition contains (A) a diorganopolysiloxane with at least two silicon bonded alkenyl groups per molecule, (B) an alumina powder with an average particle size not more than 10 &mgr;m and an ignition loss of not more than 0.15 weight percent, (C) an organohydrogenpolysiloxane having at least two silicon bonded hydrogen atoms per molecule, and (D) a platinum catalyst. Fluororesin coated fixing rolls can be fabricated by providing a fluororesin layer on the peripheral surface of a roll shaft, with the silicone rubber layer interposed between it and the surface.