Patents Assigned to Torday & Carlisle PLC
  • Treatment of copper foil
    Patent number: 4456508
    Abstract: A method of treating copper foil for use in the production of printed circuit boards includes the step of depositing onto the copper foil a layer containing nodular or dendritic zinc in such a manner as to increase the bond strength of the foil with a base material compared with untreated foil.
    Type: Grant
    Filed: September 23, 1982
    Date of Patent: June 26, 1984
    Assignee: Torday & Carlisle PLC
    Inventors: John Torday, Michael E. Bush