Patents Assigned to Torex Semiconductor Ltd
  • Semiconductor device, its manufacturing method and electrodeposition frame
    Patent number: 6800508
    Abstract: A semiconductor device includes: a semiconductor element 2 bonded on a first metallic layer; a wire 4 for electrically connecting an electrode pad of the semiconductor element to a second metallic layer; and a resin package 7 for sealing said semiconductor element. Rear surfaces of the first metallic layer 8a and the second metallic layer 8b are flush with a bottom of said resin package.
    Type: Grant
    Filed: April 18, 2001
    Date of Patent: October 5, 2004
    Assignee: Torex Semiconductor Ltd
    Inventor: Hiroshi Kimura