Abstract: A method produces a conductive substrate wherein a metal fine particle layer is laminated onto at least one surface of a base in a network form. This method includes a step for treating the metal fine particle layer with an organic solvent; and a following step for treating the metal fine particle layer with an acid. Also disclosed is a conductive substrate produced by such a method. This method enables to produce a conductive substrate, which has transparency and high conductivity and is thus suitable for electromagnetic shielding films and the like, with high productivity.