Patents Assigned to Tosetz Inc.
  • Electroplating apparatus
    Patent number: 7828944
    Abstract: An electroplating apparatus includes: a wafer holder that is detachable from an engaging hole of a cathode holder and capable of moving in a up and down direction; a spring contact type cathode electrode that is fixed to an electrode housing recess on a top surface of the wafer holder and presses against a backside of a wafer placed on the wafer holder; and a suction pad that is fixed to a pad housing recess on a top surface of the wafer holder and suctions the backside of the wafer placed on the wafer holder.
    Type: Grant
    Filed: July 18, 2007
    Date of Patent: November 9, 2010
    Assignee: Tosetz Inc.
    Inventors: Atsushi Nagashima, Hiroshi Oshibe