Patents Assigned to Toshiba American Electronic Components, Inc.
  • Publication number: 20090174468
    Abstract: Methods, systems and thermal sensing apparatus are provided that use bandgap voltage reference generators that do not use trimming circuitry. Further, circuits, systems, and methods in accordance with the present invention are provided that do not use large amounts of chip real estate and do not require a separate thermal sensing element.
    Type: Application
    Filed: March 11, 2009
    Publication date: July 9, 2009
    Applicants: Toshiba American Electronic Components, Inc., International Business Machines Corporation
    Inventors: Munehiro Yoshida, David William Boerstler
  • Patent number: 7524108
    Abstract: Methods, systems and thermal sensing apparatus are provided that use bandgap voltage reference generators that do not use trimming circuitry. Further, circuits, systems, and methods in accordance with the present invention are provided that do not use large amounts of chip real estate and do not require a separate thermal sensing element.
    Type: Grant
    Filed: May 20, 2003
    Date of Patent: April 28, 2009
    Assignees: Toshiba American Electronic Components, Inc., International Business Machines Corporation
    Inventors: Munehiro Yoshida, David William Boerstler