Abstract: Methods, systems and thermal sensing apparatus are provided that use bandgap voltage reference generators that do not use trimming circuitry. Further, circuits, systems, and methods in accordance with the present invention are provided that do not use large amounts of chip real estate and do not require a separate thermal sensing element.
Type:
Application
Filed:
March 11, 2009
Publication date:
July 9, 2009
Applicants:
Toshiba American Electronic Components, Inc., International Business Machines Corporation
Inventors:
Munehiro Yoshida, David William Boerstler
Abstract: Methods, systems and thermal sensing apparatus are provided that use bandgap voltage reference generators that do not use trimming circuitry. Further, circuits, systems, and methods in accordance with the present invention are provided that do not use large amounts of chip real estate and do not require a separate thermal sensing element.
Type:
Grant
Filed:
May 20, 2003
Date of Patent:
April 28, 2009
Assignees:
Toshiba American Electronic Components, Inc., International Business Machines Corporation
Inventors:
Munehiro Yoshida, David William Boerstler