Patents Assigned to Toshiba Automation Co., Ltd.
  • Patent number: 5516026
    Abstract: A pellet bonding apparatus is disclosed, which comprises a wafer stage, a pellet removal/transfer mechanism, a pellet position correcting mechanism, and a bonding mechanism. In the wafer stage, the wafer ring unit can be rotated through an angle corresponding to each of a plurality of areas, into which a pellet group of a wafer ring unit provided on the wafer stage can be divided. The pellet position correcting mechanism rotates a rotary table through a predetermined angle irrespective of whether the wafer ring unit has been rotated or not, whereby pellet position correction is made such that the pellet has the same orientation at all times when being removed by the bonding mechanism. A sheet expander can set the wafer ring unit on the wafer stage. It has an expander ring with an end formed with air stream outlet ports.
    Type: Grant
    Filed: October 20, 1994
    Date of Patent: May 14, 1996
    Assignee: Toshiba Automation Co., Ltd.
    Inventors: Makoto Ariye, Yasushi Takeda, Katsuyoshi Kawabe
  • Patent number: 4803923
    Abstract: A device for adjusting the amount of ink supplied for use in a printing press includes an ink blade disposed along the longitudinal direction of an ink fountain roller, ink adjusters respectively disposed for each of the longitudinally divided areas of the ink blade so as to move each area toward or away from the ink fountain roller and thereby adjust the gap between the ink blade and the ink fountain roller, ink blade position detectors for detecting the position of the ink blade adjusted by the ink adjusters, and the ink blade position control means for controlling the position of the ink blade through the ink adjusters on the basis of the zero point of the ink blade position detectors.
    Type: Grant
    Filed: December 22, 1987
    Date of Patent: February 14, 1989
    Assignees: Dai Nippon Printing Co., Ltd., Toshiba Automation Co., Ltd.
    Inventor: Mizuno Kenichi