Patents Assigned to Toshiba Chemical Products Co., Ltd.
  • Patent number: 4530779
    Abstract: A conductive synthetic resin composition, which is suited for manufacturing a molded product having an excellent electromagnetic shielding effect, and comprises master pellets consisting of a cylindrical synthetic resin layer and a bundle of a number of strands of fibrous conductive filler filled inside said synthetic resin layer in a longitudinal direction thereof, the master pellets being cut in the form of pellets; and natural pellets consisting of a synthetic resin.
    Type: Grant
    Filed: October 11, 1983
    Date of Patent: July 23, 1985
    Assignee: Toshiba Chemical Products Co., Ltd.
    Inventors: Toshio Mayama, Hidehiro Iwase
  • Patent number: 4472482
    Abstract: An electric implement having a combination of insulation coverages comprising a thermosetting resin impregnated in an insulation layer wound about the electric implement, and a photohardening resin deposited over the impregnated thermosetting resin. A method of electrically insulating the electric implement, comprising impregnating the insulation layer with a thermosetting resin in vacuum; depositing a photohardening resin on the exposed portion of the thermosetting resin layer; photopolymerizing the photohardening resin; and thermosetting the impregnated thermosetting resin.
    Type: Grant
    Filed: August 4, 1982
    Date of Patent: September 18, 1984
    Assignees: Tokyo Shibaura Denki Kabushiki Kaisha, Toshiba Chemical Products Co., Ltd.
    Inventors: Kenichi Sato, Hikaru Okunoyama
  • Patent number: 4128598
    Abstract: Thermosetting resin compounds produced by polymerizing together bismaleimide expressed by the general structural formula: ##STR1## where: R.sub.1 is hydrogen or alkyl group,R.sub.2 is --O--, --CH.sub.2 --, --SO.sub.2 -- or --S--S--, andR.sub.3 is hydrogen, alkyl group or chlorine;Aminophenol expressed by the general structural formula: ##STR2## where R.sub.4 is hydrogen, halogens or alkyl group; A SPECIFIED EPOXY COMPOUND; AND IMIDAZOLE WHICH IS EXPRESSED BY THE GENERAL STRUCTURAL FORMULA: ##STR3## where R.sub.7 to R.sub.10 are hydrogen or alkyl group and R.sub.7 and R.sub.8 may be benzyl or phenyl, and which may be added, if necessary.
    Type: Grant
    Filed: June 24, 1977
    Date of Patent: December 5, 1978
    Assignee: Toshiba Chemical Products Co. Ltd.
    Inventors: Kiyoji Makino, Tsutomu Ohkawa
  • Patent number: 4107153
    Abstract: A heat-resistant thermosetting resin composition is obtained by reaction with each other of an N,N'-bis-imide of unsaturated dicarboxylic acid (A), a cyanuric or isocyanuric acid or derivatives thereof (B), and at least one compound (C) selected from the group consisting of tetracarboxylic acid diimide, hydantoin and derivatives thereof, and barbituric acid and derivatives thereof. This resin composition has excellent heat-resistance and workability, and is employed for the use of a molding, laminated sheet, adhesive, etc.
    Type: Grant
    Filed: September 23, 1975
    Date of Patent: August 15, 1978
    Assignee: Toshiba Chemical Products Co., Ltd.
    Inventors: Keiichi Akiyama, Junichi Kamiuchi, Itsuo Matsuda, Takara Fujii
  • Patent number: 4097545
    Abstract: A heat-resistant thermosetting resin composition is obtained by reaction with each other of an N,N'-bis-imide of unsaturated dicarboxylic acid (A), a cyanuric or isocyanuric acid or derivatives thereof (B), and at least one compound (C) selected from the group consisting of tetracarboxylic acid diimide, hydantoin and derivatives thereof, and barbituric acid and derivatives thereof. This resin composition has excellent heat-resistance and workability, and is employed for the use of a molding, laminated sheet, adhesive, etc.
    Type: Grant
    Filed: August 30, 1976
    Date of Patent: June 27, 1978
    Assignee: Toshiba Chemical Products Co. Ltd.
    Inventors: Keiichi Akiyama, Junichi Kamiuchi, Itsuo Matsuda, Takara Fujii
  • Patent number: 4052358
    Abstract: An unsaturated polyester resin composition comprises a mixture of a particular unsaturated polyester, an unsaturated monomer copolymerizable with the unsaturated polyester and polystyrene having a certain particle size in specific amounts. The unsaturated polyester is a reaction product of a dicarboxylic acid component containing .alpha.,.beta.-unsaturated dicarboxylic acid with a glycol component containing certain amounts of neopentyl glycol and 2,2-bis(4-hydroxycyclohexyl) propane. The resin composition exhibits favorable properties such as low shrinkage upon curing, good colorability and good storage stability, and is useful particularly in formulating premixed molding compounds.
    Type: Grant
    Filed: February 19, 1976
    Date of Patent: October 4, 1977
    Assignees: Tokyo Shibaura Electric Co., Ltd., Toshiba Chemical Products Co., Ltd.
    Inventors: Moriyasu Wada, Katuya Kumagai, Takashi Kamo