Patents Assigned to TOSHIBA INDUSTRIAL PRODUCTS AND SERVICES CORP.
  • Publication number: 20190019606
    Abstract: A coil of an embodiment is formed by winding a winding conductor in which a conductive conductor is molded by a resin, wherein the winding conductor has the resin filled to a surface of the conductor without leaving any spaces.
    Type: Application
    Filed: August 31, 2018
    Publication date: January 17, 2019
    Applicant: TOSHIBA INDUSTRIAL PRODUCTS AND SERVICES CORP.
    Inventors: Hiromu Shiota, Eiji Shimomura, Keishi Ito, Hiroshi Goto, Teruhiko Maeda, Yuusuke Shima