Abstract: A coil of an embodiment is formed by winding a winding conductor in which a conductive conductor is molded by a resin, wherein the winding conductor has the resin filled to a surface of the conductor without leaving any spaces.
Type:
Application
Filed:
August 31, 2018
Publication date:
January 17, 2019
Applicant:
TOSHIBA INDUSTRIAL PRODUCTS AND SERVICES CORP.