Abstract: A process for forming a circuit pattern on a substrate includes steps of forming a number of electrical circuits on a substrate, which circuits include an electrically conductive bus that interconnects the circuits, covering the electrical circuits with a soldermask, leaving electrical contact portions exposed, electroplating the exposed electrical contacts with a conductive surface finish by using the bus to electrolytically apply the surface finish, and then severing the bus at locations between circuits so that the circuits are electrically isolated from each other. The process may be used to make circuit boards and especially integrated circuit packages.