Abstract: An optical phase modulation module and a projector comprising the same are provided. The optical phase modulation module comprises a transparent thin film with an electro-optic effect, a plurality of first upper electrodes, a plurality of second upper electrodes and a plurality of lower electrodes. The transparent thin film with the electro-optic effect has a top surface and a bottom surface. The first upper electrodes are formed on the top surface. The second upper electrodes are formed on the top surface and arranged alternately with the first upper electrodes. The lower electrodes are formed on the bottom surface. A first voltage difference exists between the first upper electrodes and the bottom electrodes, while a second voltage difference exists between the second upper electrodes and the bottom electrodes. Two different electric fields are produced within the transparent thin film with the electro-optic effect by the first voltage difference and the second voltage difference respectively.

Abstract: A biaxial scanning mirror for an image forming apparatus includes a first wafer, a second wafer, and a spacer. The first wafer includes a mirror unit, a rectangular rotating unit, a permanent magnet, and a magnetically permeable layer. The second wafer has at least two cores each surrounded by a planar coil applied with an AC current for switching magnetic polarization of the cores such that the cores are attracted to or repelled from the rotating unit alternatively, thereby driving the rotating unit to rotate.

Abstract: A method of making a planar coil is disclosed in the present invention. First, a substrate having a trench is provided. Then, a barrier and a seed layer are formed on the substrate in sequence. An isolative layer is used for guiding a conductive material to flow into a lower portion of the trench such that accumulation of the conductive material at opening of the trench is prevented before the lower portion of the trench is completely filled up, thereby avoiding gap formation in the trench.

Abstract: A method of making a planar coil is disclosed in the present invention. First, a substrate having a trench is provided. Then, a barrier and a seed layer are formed on the substrate in sequence. An isolative layer is used for guiding a conductive material to flow into a lower portion of the trench such that accumulation of the conductive material at opening of the trench is prevented before the lower portion of the trench is completely filled up, thereby avoiding gap formation in the trench.

Abstract: A biaxial scanning mirror is disclosed in the present invention. The mirror includes: a first wafer having several cavities forming a first row and a second row, several permanent magnets each installed in one of the cavities, a spacer and a second wafer. The second wafer includes: a mirror unit, rotating around a first axis, for reflecting light beams; and a rotating unit, formed around the mirror unit, for rotating the mirror unit around a second axis which is perpendicular to the first axis. At least one coil substrate having a planar coil is assembled in the rotating unit.

Abstract: A method of making a white LED package structure having a silicon substrate comprises providing a silicon substrate and performing an etching process to form a plurality of cup-structures on a top surface of the silicon substrate. Next, a reflective layer on the top surface of the silicon substrate is formed, and a transparent insulating layer on the reflective layer is formed. Subsequently, a plurality of blue LEDs are respectively bonded in each cup-structure, wherein the blue LEDs have various wavelengths. Last, a plurality of kinds of phosphor powders corresponding to the wavelengths of the blue LEDs are mixed with each other and added to a sealing material, and a sealing process is performed to form a phosphor structure on the cup-structures.

Abstract: The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor processes in batch. Also, the concentration of phosphors in individual regions can be accurately and easily controlled by a laser printing process or by light-through holes. Accordingly, the optic effects of light emitting diode packages can be accurately adjusted.

Abstract: A torsional MEMS device is disclosed. The torsional MEMS device includes a support structure, a platform, and at least two hinges, which connects the platform to the support structure. The platform has an active area and a non-active area. A plurality of sacrificial elements is disposed in the non-active area. If the resonant frequency of the torsional MEMS device is less than a predetermined standard resonant frequency of the torsional MEMS device, at least one sacrificial element is removed to reduce the total mass of the torsional MEMS device, and so as to increase the resonant frequency of the torsional MEMS device.

Abstract: The LED chip package of the present invention uses a semiconductor substrate as package substrate, which improves heat dissipation. Also, the LED chip package is incorporated with a planarization structure, which renders the LED chip and the substrate a substantially planar surface, thereby making formation of a planar patterned conductive layer possible. Accordingly, serial/parallel electrical connections between light emitting diode chips can be easily implemented by virtue of the planar patterned conductive layer.