Patents Assigned to Touch Micro-Systems Technology Inc.
  • Method for bonding wafers
    Patent number: 7192842
    Abstract: A first wafer is provided, and a photosensitive masking-and-bonding pattern is formed on the surface of the first wafer. Then, an etching process using the photosensitive masking-and-bonding pattern as a hard mask is performed to form a wafer pattern on the surface of the first wafer. Finally, the first wafer is bonded to a second wafer with the photosensitive masking-and-bonding pattern.
    Type: Grant
    Filed: January 20, 2005
    Date of Patent: March 20, 2007
    Assignee: Touch Micro-Systems Technology Inc.
    Inventors: Shih-Feng Shao, Hsin-Ya Peng, Chen-Hsiung Yang