Abstract: Dual sealing assemblies for mating and isolating a wire chamber from an electronics chamber within an electrical device enclosure is disclosed. The dual sealing assemblies include a dual chamber housing, wherein the dual chamber housing includes an electronics chamber and a wire chamber, and wherein the dual chamber housing isolates the electronics chamber from the wire chamber. The electrical device enclosure includes an electronics chamber cover mateable with the dual chamber housing for enclosing the electronics chamber; and, a wire chamber cover mateable with the dual chamber housing for enclosing the wire chamber. The wire chamber includes a compressible stubbed gasket having at least one locating stub corresponding to a receptacle in the dual chamber housing for positioning and holding the gasket within the top section during assembly.

Abstract: In accordance with one embodiment of the present invention a multi-chamber GFCI housing apparatus is provided. The multi-chamber GFCI housing includes a printed circuit board (PCB) chamber and an isolated cable chamber; each chamber is independently accessible and water resistant. In addition, the relative volumes, of each independent chamber permit sufficient housing volume to allow for sufficient spacing between electrical GFCI components and electrical PCB traces to prevent the risk of arcing between the components while also adhering to constrained dimensions according to electrical codes and standards.