Abstract: The photosensitive compound of the present invention contains the following unit: ##STR1## and is particularly expressed by the following formula: ##STR2## Different photosensitive resin compositions can be prepared from this novel photosensitive resin compound, and the resulting photosensitive resin compositions do not raise the problem of environmental pollution, exhibit high resolution, possess a high level of sensitivity, and exhibit excellent adhesion with substrates, coating characteristics and storage stability.
Type:
Grant
Filed:
May 13, 1998
Date of Patent:
February 1, 2000
Assignee:
Toyo Gosei Kogyo, Ltd.
Inventors:
Toru Shibuya, Jian Rong Xie, Noriaki Tochizawa