Patents Assigned to TOYOTA CUSTOMIZING & DEVELOPMENT CO., LTD.
  • Bonding system and bonding method
    Patent number: 11787126
    Abstract: A bonding system includes a supporting jig having a mounting surface on bonding substrates which are mounted, a bonding device that sandwiches and welds the bonding substrates between itself and the mounting surface, an articulated robot to which the bonding device is attached, and a control unit that controls the articulated robot and the bonding device.
    Type: Grant
    Filed: March 23, 2018
    Date of Patent: October 17, 2023
    Assignees: TOYOTA CUSTOMIZING & DEVELOPMENT CO., LTD., AISIN SEIKI KABUSHIKI KAISHA, TOYOTA JIDOSHA KABUSHIKI KAISHA, NATIONAL UNIVERSITY CORPORATION NAGOYA UNIVERSITY, TORAY INDUSTRIES, INC., TEIJIN LIMITED, KOMATSU LTD., SUBARU CORPORATION
    Inventors: Kenji Furuyashiki, Hiroshi Yuchi, Satoshi Hirawaki, Yoshinori Yamamori, Takayuki Mori, Yoshihiro Iwano, Kazuaki Amaoka