Abstract: Vehicle body panels and systems are described. A vehicle body panel may include at least one layer of material defining the vehicle body panel and one or more than one electronic device, where a portion of each electronic device is embedded within one or more than one of the at least one layer of material. Each electronic device may communicate with a control system or a vehicle control unit of the vehicle to support an advanced-feature functionality of the vehicle. At least one electronic device may include a first portion embedded within the one or more than one of the at least one layer of material. The first portion may be couplable to a second portion, not embedded within the material, where the first portion upon being coupled to the second portion communicates with the control system or the vehicle control unit of the vehicle to support the advanced-feature functionality.

Abstract: In one embodiment, a method of evaluating stability of software code for a control system includes receiving a set of initial trajectories by a semidefinite programming solver module, and determining one or more candidate Lyapunov functions based on the set of initial trajectories. The method further includes performing a plurality of simulations using a model of the control system to create a set of discovered trajectories, and evaluating the set of discovered trajectories to determine one or more counterexample trajectories that violate one or more Lyapunov conditions. If one or more counterexample trajectories are discovered, then the method includes inputting the set of discovered trajectories including the one or more counterexample trajectories into the semidefinite programming solver module, and determining, by the semidefinite programming solver module, one or more additional candidate Lyapunov functions from the set of initial trajectories and the set of discovered trajectories.

Abstract: A process of forming a semiconductor integrated circuit that includes the steps of: forming at least a first element having a first pattern of conductive material and including a polymer layer surrounding the conductive material, forming at least a second element having a second pattern of conductive material and including a polymer layer surrounding the conductive material, positioning the first element relative to the second element, and bonding the polymer layer of the first and second elements at a temperature below a melting temperature of the conductive materials of the first and second elements wherein the conductive material of the first element contacts the conductive material of the second element and is maintained in position by the bonded polymer layers.