Patents Assigned to Tozuka-Tendo Co., Ltd
  • Patent number: 6554053
    Abstract: A method of minimizing the size of primary Si in Al—Si alloy which includes a step of adding P to molten Al—Si alloy, a step of contacting a metal substrate plated with Zn or a copper substrate, and a step of removing the substrate from the molten Al—Si alloy.
    Type: Grant
    Filed: March 5, 2002
    Date of Patent: April 29, 2003
    Assignees: Tozuka-Tendo Co., Ltd, Metal Science Ltd.
    Inventors: Kazuhiko Takata, Yasuaki Kawai, Mayuki Morinaka
  • Publication number: 20020124985
    Abstract: A method of minimizing the size of primary Si in Al—Si alloy which comprises of a step of adding P to molten Al—Si alloy, a step of contacting a metal substrate plated with Zn or a copper substrate, and a step of removing the substrate from the molten Al—Si alloy.
    Type: Application
    Filed: March 5, 2002
    Publication date: September 12, 2002
    Applicant: Tozuka-Tendo Co., Ltd.
    Inventors: Kazuhiko Takata, Yasuaki Kawai, Mayuki Morinaka