Patents Assigned to TPL, Inc. title and interest in an application
  • Moldable high dielectric constant nano-composites
    Publication number: 20060074166
    Abstract: The present invention comprises the use of high dielectric constant composite materials comprising a high particle loading to form molded structures comprising three dimensional shapes. The composite material comprises ceramic dielectric particles, preferably nano-sized particles, and a thermoset polymer system. The composite material exhibits a high energy density.
    Type: Application
    Filed: December 20, 2004
    Publication date: April 6, 2006
    Applicant: TPL, Inc. title and interest in an application
    Inventors: Kirk Slenes, Christopher Labanowski