Patents Assigned to Tra-Con, Inc.
  • Controlled highly densified diamond packing of thermally conductive electrically resistive conduit
    Patent number: 5141050
    Abstract: The invention provides a system and method for fabricating an electrically resistive, high density diamond-packed thermal conduit for electrical components. An exemplary conduit provides superior thermal transfer between two objects. This is achieved by establishing, within a flowable and highly shrinkable electrically insulative carrier medium such as acrylic, intimate contact between diamond particles preferably having an aspect ratio of 1.35 or less.
    Type: Grant
    Filed: July 31, 1991
    Date of Patent: August 25, 1992
    Assignee: Tra-Con, Inc.
    Inventor: Charles F. Schuft