Abstract: A compact multiple output power supply which has a circuit architecture with distinct primary and secondary circuit domains. Within the secondary circuit domain, a distribution bus of relatively low constant voltage supplies power inputs to d.c.-to-d.c. converters providing regulated outputs and operating independently of each other. Because of the secondary circuit domain topology, surface mount components are made available in conjunction with relatively simple converter circuitry. Heat management within the compact housing of the power supply is achieved through the utilization of linear driven air flows in combination with employment of heat sinks extending to the heat sink configured cover of the housing. Additionally, the highest heat generation components are positioned rearwardmost within the driven air path.

Abstract: A compact multiple output power supply which has a circuit architecture with distinct primary and secondary circuit domains. Within the secondary circuit domain, a distribution bus of relatively low constant voltage supplies power inputs to d.c.-to-d.c. converters providing regulated outputs and operating independently of each other. Because of the secondary circuit domain topology, surface mount components are made available in conjunction with relatively simple converter circuitry. Heat management within the compact housing of the power supply is achieved through the utilization of linear driven air flows in combination with employment of heat sinks extending to the heat sink configured cover of the housing. Additionally, the highest heat generation components are positioned rearwardmost within the driven air path.

Abstract: A power supply/backplane assembly and system wherein a substantially flat power supply assembly including a printed circuit, power converter modules, and heat sink is mounted directly to the rearwardly disposed surface of a backplane. The size of the power supply and the region at which it is mounted substantially falls within the border of a fully defined region of the backplane. Flat copper traces carried by the power supply circuit board function to carry regulated power directly to the backplane via a power bolt system. Thus, conventional cabling is eliminated. The circuit board also is employed in conjunction with readily accessible connector components to provide for simplified wiring installation of support features such as the interaction between a supervisory panel and a front end a.c.-to-d.c. conversion component.

Abstract: A thin power supply is configured to be mounted vertically within a card cage for pin assembly connection with the forward face of a backplane. Through the utilization of a vertical flat metal platform in combination with a thin sheet metal folded fin array, the components of the power supply may be cooled by fan driven air of passing through the card cage itself. To achieve heat dissipation, those components of the power supply which exhibit higher heat dissipation characteristics are firmly coupled with the power supply platform such that the bulk of the heat generated by them is dissipated by the folded fin array and the card cage fan driven air passing over and through it. Other components not having high beat dissipation characteristics are circuit board mounted and cooled by the movement of fan driven card cage air flow which passes through the housing of the power supply.