Abstract: A very light enclosure for electronic systems incorporates a rigid core enclosure structure formed with forward and rearward rigid, zig-zag configured, generally open mesh structure stabilization frames extending between oppositely disposed connection ends. The connection ends are rigidly attached to oppositely disposed sheet metal side assemblies to complete the core enclosure structure. The structure stabilization frames directly support card guides and power supply modules on oppositely disposed sides of a backplane tray.

Abstract: Method and System for dissipating thermal energy from conduction-cooled circuit card assemblies in which thermal energy is directed into proximate heat sink assemblies and additionally is conveyed by heat pipes to one or more remote heat sink assemblies configured for the transfer of thermal energy to a flow of air and located within a chassis at a position remote from the system thermal load.

Abstract: Method and System for dissipating thermal energy from conduction-cooled circuit card assemblies in which thermal energy is directed into proximate heat sink assemblies and additionally is conveyed by heat pipes to one or more remote heat sink assemblies configured for the transfer of thermal energy to a flow of air and located within a chassis at a position remote from the system thermal load.

Abstract: A transportable container for electrical devices having aluminum bottom, top and end panels. The top and bottom panels are configured having spaced apart interior and exterior sheet members laser welded to a corrugate stiffener. Each end panel is structured with an exterior sheet member spaced from an interior plurality of drawer guides laser welded to a corrugate stiffener. A plurality of aluminum drawers are mounted upon the drawer guides, each having an air entrance opening at its back communicating with air transfer outlets at a fan charged air distribution plenum. Conditioned a. c. power is provided at receptacles within each drawer as well as LAN connectors.