Patents Assigned to TRANSISTOR DEVICES, INC. D/B/A TDI POWER
  • Publication number: 20140318984
    Abstract: In some embodiments, an ICCP system includes an AC-DC rectifier receiving AC power from an AC power source and providing a DC output having a constant voltage or a constant current, a cathode connection electrically coupling the AC-DC rectifier to a structure to be protected by the ICCP system, current-emitting anodes arranged in parallel and receiving the DC output from the AC-DC rectifier, and a controller communicating with the AC-DC rectifier to set a maximum value for the constant voltage or constant current of the DC output. In other embodiments, an ICCP system includes a converter assembly including an AC-DC rectifier and a rectifier chassis enclosing and environmentally sealing the AC-DC rectifier. The ICCP system also includes an environmentally-sealed controller communicating with the AC-DC rectifier and an environmentally-protected Input-Output connection assembly.
    Type: Application
    Filed: April 29, 2014
    Publication date: October 30, 2014
    Applicant: Transistor Devices, Inc. d/b/a TDI Power
    Inventors: Gary Mulcahy, John Santini
  • Publication number: 20140325245
    Abstract: A system providing an optimized power delivery and management of USB power in a closed network, such as found on commercial aircraft. The system enables utilization of a limited number of AC-DC step down and isolation converters to support a multitude of USB power outlets. It provides a means of accounting for, and overcoming wire distribution losses, while also providing for voltages and power levels compatible with the USB Power Delivery Specification.
    Type: Application
    Filed: April 29, 2014
    Publication date: October 30, 2014
    Applicant: Transistor Devices, Inc. d/b/a TDI Power
    Inventors: John Santini, Gary Mulcahy
  • Publication number: 20140262150
    Abstract: A functional heat exchanger structure provides a hermetic seal for the power electronics. The heat exchanger includes one or more features built into the design. The features include a closed loop liquid circuit, air, or extended surfaces built-in to the design to transfer heat from the heat generating devices, spring clips snapped in built-in slots to mount heat-generating devices, preformed threaded rails to mount the printed circuit board (PCB), electrical isolation between the heat sink/cold plate and the electrical components, a sealed enclosure to provide environmental protection for the electronic components, a mounting feature to mount the sealed enclosure onto an external surface, an opening to accept a snap-in style cover, a stackable design, and an easily manifoldable configuration.
    Type: Application
    Filed: March 12, 2014
    Publication date: September 18, 2014
    Applicant: Transistor Devices, Inc. d/b/a TDI Power
    Inventors: Tunc Icoz, John Santini, Gary Mulcahy, James Feely
  • Publication number: 20140254218
    Abstract: A circuit for connecting lower AC voltage-rated AC-DC power supplies with higher voltage power sources. A power line matching transformer connecting the source to the power supplies needs only to support the self-dissipation and output current mismatch between supplies. The circuit can also protect the line matching transformer from overheating in various fault scenarios.
    Type: Application
    Filed: March 8, 2013
    Publication date: September 11, 2014
    Applicant: TRANSISTOR DEVICES, INC. D/B/A TDI POWER
    Inventors: John Santini, Thomas A. Hansen, Gary Mulcahy
  • Publication number: 20130241284
    Abstract: A power management system for distributed power management from a power source to a plurality of power units, using a monitor bus to monitor total power usage on a branch to which the power unit is assigned, allowing power to be delivered if it won't result in a maximum current draw from the power source being exceeded, and denying access if it would. Each power unit adds a signal to the monitor bus proportional to the current it is drawing from the power source.
    Type: Application
    Filed: March 7, 2013
    Publication date: September 19, 2013
    Applicant: Transistor Devices, Inc. . d/b/a TDI Power
    Inventors: John Santini, Lazar Rozenblat, Ronald DeLuca, Gary Mulcahy
  • Publication number: 20120138281
    Abstract: A liquid-cooled heat exchanger for electronic assemblies and a method of making the heat exchanger. The exchanger has a solid metal body in the form of an elongated flat plate to which the electronic assembly can be mounted, or a number of such plates formed in an L- or U-shaped configuration to enclose two or more sides of the assembly. The elongated body is formed by extrusion, with parallel enclosed longitudinal passages formed along a length of the body during the extrusion process. Transverse passages are drilled to intersect the extruded longitudinal passages. The longitudinal passages and transverse passages are plugged on at least one of their outside ends, and optionally at points along their lengths, to create desired patterns of liquid flow through the heat exchanger.
    Type: Application
    Filed: September 22, 2011
    Publication date: June 7, 2012
    Applicant: TRANSISTOR DEVICES, INC. D/B/A TDI POWER
    Inventors: John Santini, Ronald Tallman, Gary Mulcahy