Abstract: Method for manufacturing microelectromechanical mirror and mirror array. Control electrodes and addressing circuitry are etched from a metallic layer deposited onto a reference layer substrate. Standoff-posts are etched from a subsequently deposited polyimide layer. A freely movable plate flexibly suspended from a plurality of electrostatic actuators that are flexibly suspended from a support frame is etched from an actuation layer substrate using a high aspect ratio etch. A mirror support post and surface are etched from a mirror substrate using a high aspect ratio etch. The mirror and actuation layer substrates are fusion bonded together. The reference and actuation layer substrates are bonded together and held apart by the standoff posts. A reflective metallic layer is deposited onto the mirror surface and polished. The mirror is etched from the mirror surface to free the microelectromechanical mirror. Mirror arrays are made by performing the aforementioned steps using standard IC processing techniques.

Abstract: A freely rotatable microelectromechanical mirror and mirror array. Each mirror is connected to a plate flexibly suspended from a plurality of actuators by a plurality of plate flexures. The actuators are flexibly suspended from a support structure by a plurality of actuator flexures. The support structure is held above and electrically isolated from a reference layer by a plurality of standoff posts. The reference layer contains a plurality of actuation means such as control electrodes to move the actuators in first and second directions when actuated. Control voltages can be selectively applied to selective control electrodes to selectively move the actuators, and extend the plurality of plate flexures. The extended plate flexures create a net restoring force or torque to translate or rotate the freely movable plate. The plate and attached mirror are thereby translated or rotated about an arbitrary axis of rotation without stress.

Abstract: Method for manufacturing microelectromechanical mirror and mirror array. Control electrodes and addressing circuitry are etched from a metallic layer deposited onto a reference layer substrate. Standoff-posts are etched from a subsequently deposited polyimide layer. A freely movable plate flexibly suspended from a plurality of electrostatic actuators that are flexibly suspended from a support frame is etched from an actuation layer substrate using a high aspect ratio etch. A mirror support post and surface are etched from a mirror substrate using a high aspect ratio etch. The mirror and actuation layer substrates are fusion bonded together. The reference and actuation layer substrates are bonded together and held apart by the standoff posts. A reflective metallic layer is deposited onto the mirror surface and polished. The mirror is etched from the mirror surface to free the microelectromechanical mirror. Mirror arrays are made by performing the aforementioned steps using standard IC processing techniques.