Patents Assigned to TRANSSIP, INC.
  • Publication number: 20220113352
    Abstract: A time and frequency domain signal conditioning device including one or more signal terminals, one or more rails, and a passive signal conditioning means for reducing a switching noise jitter signature present in an output signal of a feedback control loop circuitry with a plurality of noise carrying jittering ramps is disclosed. The passive signal conditioning means including the rails is characterized by a set of specified characteristics to condition pre-existing noise amplitude and slopes of the output signal such that the conditioned output signal cooperates with the feedback control loop circuitry. As a consequence, the switching noise jitter signature which is produced by transient noise displacement or noise perturbation in the time domain when the output signal jitters can be reduced in the output of the feedback control loop circuitry.
    Type: Application
    Filed: December 22, 2021
    Publication date: April 14, 2022
    Applicant: TransSiP, Inc.
    Inventor: Chih Wei Wong
  • Patent number: 11243249
    Abstract: A time and frequency domain signal conditioning device including one or more signal terminals, one or more rails, and a passive signal conditioning means for reducing a switching noise jitter signature present in an output signal of a feedback control loop circuitry with a plurality of noise carrying jittering ramps is disclosed. The passive signal conditioning means including the rails is characterized by a set of specified characteristics to condition pre-existing noise amplitude and slopes of the output signal such that the conditioned output signal cooperates with the feedback control loop circuitry. As a consequence the switching noise jitter signature which is produced by transient noise displacement or noise perturbation in the time domain when the output signal jitters can be reduced in the output of the feedback control loop circuitry.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: February 8, 2022
    Assignee: TRANSSIP, INC.
    Inventor: Chih Wei Wong
  • Patent number: 10942219
    Abstract: A circuit arrangement and methods for reducing a switching noise jitter signature in an output signal of a feedback control loop circuitry are disclosed. The passive signal conditioning means including the rails is closely coupled to the common connection junction and is characterized by a set of specified characteristics to condition pre-existing noise amplitude and slopes of the output signal so as to improve the interactions between the output signal and the feedback control loop circuitry. As a consequence, the switching noise jitter signature, which is produced by transient noise displacement or noise perturbation in the time domain when the output signal jitters, can be reduced in the output of the feedback control loop circuitry.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: March 9, 2021
    Assignee: TRANSSIP, INC.
    Inventor: Chih Wei Wong
  • Patent number: 10319685
    Abstract: An integrated circuit package with a plurality of embedded electromagnetic interference (EMI) shielding and methods of making the same are disclosed. The integrated circuit packages include the use of a pre-assembled circuit module and an interposer. The circuit module has a plurality of spaced electrical component sections separated by a series of contiguous conductive spacers, and a first shielding means comprises the spacers, vias and an embedded conductive plane. In an example, the interposer has a second shielding means comprises conductive cavities, conductive ridges, vias, and a conduction pattern. In another example, the interposer further comprises conductive strips to form the second shielding means. The first shielding means overlaps the second shielding means to form a plurality of EMI shielded enclosures for holding the spaced electrical component sections therein.
    Type: Grant
    Filed: February 15, 2017
    Date of Patent: June 11, 2019
    Assignee: TRANSSIP, INC.
    Inventors: Chih Wei Wong, Henry Lau
  • Patent number: 9748663
    Abstract: This invention enables Frequency Selective Surface (“FSS”) and Artificial Magnetic Conductor (“AMC”) which exhibits Electromagnetic Band Gap (“EBG”) in any of the substrate's layer from a small and thin systems and sub-systems in package to a large-format PCBs. The metamaterial substrate may be integrated with electronic circuit components or buried in PCBs for circuit designs capable of transmitting, receiving and reflecting electromagnetic energy, altering electromagnetic properties of natural circuit materials, enhancing electrical characteristics of electrical components (such as filters, antennas, baluns, power dividers, transmission lines, amplifiers, power regulators, and printed circuits elements) in systems and sub-systems circuit designs. The metamaterial substrate creates new electrical characteristics, properties and systems, sub-systems or component's specification not readily available with conventional circuit materials, substrates, and PCBs.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: August 29, 2017
    Assignee: TRANSSIP, INC.
    Inventor: Chih Wei Wong