Abstract: A power distribution device may include an input port configured to receive power form a power source, a plurality of sockets arranged along a first plane to from a matrix, each of the plurality of sockets including first and second terminals, the first terminals coupled to the input port, the first and second terminals of each of the plurality of sockets configured to deliver the power therebetween upon coupling to a connection device, and a plurality of output ports aligned along a second plane, each of the plurality of output ports coupled to the second terminal of one of the plurality of sockets, the plurality of output ports configured to distribute the power to one or more power loads.

Abstract: A surge protection circuit may include a tuned circuit board with traces designed to provide a surge protected and RF isolated DC path while propagating RF signals through the PCB dielectric with microstrip lines. The surge protection circuit utilizes high impedance RF decoupling devices such as quarterwave traces or inductors which isolate the multistage DC protection scheme which may include a gas discharge tube, serial surge impeding devices such as inductors and/or resistors, a decoupled air/spark gap device and a Zener diode junction.

Abstract: A surge suppressor device includes a first housing defining a first cavity, input and output conductors disposed in the first cavity of the first housing, a capacitor connected in series with the input conductor and the output conductor, a first spiral inductor having an inner edge connected to the input conductor and an outer edge and a second spiral inductor having an inner edge connected to the output conductor and an outer edge. The surge suppressor device further includes a second housing defining a second cavity and connected to the first housing, a feed-through connecting the first cavity to the second cavity, a non-linear protection device positioned in the second cavity of the second housing and a first electrical wire passing through the feed-through and connecting the outer edge of the first spiral inductor to the non-linear protection device.

Abstract: A high power band pass RF filtering device having a housing for containing a printed circuit board with filtering components for achieving strong attenuation of out-of-band signals. An input port and an output port on the housing electrically connect to a respective input node and output node on the printed circuit board. Surge protection elements are connected at the input port and at the output port for dissipating surge conditions present at the input port or the output port to the housing before the surge travels through the printed circuit board. A non-surge signal present on the input port can travel through the filtering components on the printed circuit board towards the output port. An oil or other fluid is disposed and completely contained within the housing and contacts the printed circuit board for cooling the printed circuit board or the filtering components.

Abstract: A surge suppression device may include a housing having a cavity, a center conductor positioned within the cavity, a spiral inductor having an inner curve coupled to the center conductor and an outer curve, a coil capture device connected to the outer curve of the spiral inductor, and a ring assembly having a first ring connected to the coil capture device, a second ring connected to the housing, and a voltage limiting device positioned between the first ring and the second ring.

Abstract: A surge protection circuit may include a tuned circuit board with traces designed to provide a surge protected and RF isolated DC path while propagating RF signals through the PCB dielectric with microstrip lines. The surge protection circuit utilizes high impedance RF decoupling devices such as quarterwave traces or inductors which isolate the multistage DC protection scheme which may include a gas discharge tube, serial surge impeding devices such as inductors and/or resistors, a decoupled air/spark gap device and a Zener diode junction.

Abstract: An electrical component assembly includes a first printed circuit board (PCB) having a plurality of first-PCB conductive paths communicating with the surface of the first PCB, the assembly also includes at least one additional PCB having a plurality of additional-PCB conductive paths communicating with the surface of the PCB, with the conductive paths located such that when the additional PCBs and the first PCB are positioned one on top of the other, the conductive paths of the PCBs are substantially aligned, the conductive paths being formed from solder-filled vias passing through the PCBs and electrically-conductive junction pads positioned on the surface of the PCBs. The assembly also includes a plurality of electrical circuit components, wherein each component is electrically connected to a conductive path of one of the PCBs at one end and to a conductive path of another of the PCBs at the other end, the assembly also includes a plurality of traces that connect conductive paths.

Abstract: A method and apparatus for protecting electrical circuits by suppressing voltage and/or current transients while simultaneously filtering unwanted noise, such as electromagnetic interference (EMI), at specially selected frequencies, by controlling the spatial array of devices in an electronic package to tailor the impedance versus frequency characteristics of the overall package.