Patents Assigned to Triangle Research & Development Corp.
  • Patent number: 5224356
    Abstract: A method of using microencapsulated thermal conducting absorbing materials to cool heat sources is disclosed. Also disclosed are microcapsules containing a thermal energy conducting material. According to the method, these materials may be used alone or as a mixture and may be employed as a powder or incorporated into a hardenable matrix such as an epoxy resin.
    Type: Grant
    Filed: September 30, 1991
    Date of Patent: July 6, 1993
    Assignee: Triangle Research & Development Corp.
    Inventors: David P. Colvin, Yvonne G. Bryant, James C. Mulligan