Abstract: A method of using microencapsulated thermal conducting absorbing materials to cool heat sources is disclosed. Also disclosed are microcapsules containing a thermal energy conducting material. According to the method, these materials may be used alone or as a mixture and may be employed as a powder or incorporated into a hardenable matrix such as an epoxy resin.
Type:
Grant
Filed:
September 30, 1991
Date of Patent:
July 6, 1993
Assignee:
Triangle Research & Development Corp.
Inventors:
David P. Colvin, Yvonne G. Bryant, James C. Mulligan