Patents Assigned to Trikon Holdings Ltd.
  • Method of treating an insulting layer
    Patent number: 6824699
    Abstract: This invention relates to a method of heating an insulating layer, such as is found in semiconductor devices, in which a formation has been etched through a layer of resist comprising reactive etching the resist, inhibiting absorption of or removing water vapour and/or oxygen at the exposed surfaces of the etched formation and filling the formation with conductive metal in the absence of said water vapour and/or oxygen.
    Type: Grant
    Filed: May 16, 2003
    Date of Patent: November 30, 2004
    Assignee: Trikon Holdings Ltd.
    Inventor: Christopher David Dobson
  • Methods and apparatus for forming a film on a substrate
    Patent number: 6627535
    Abstract: This invention relates semiconductor devices incorporating an intermediate etch stop layer between two dielectric layers in which the dielectric constant of each of the layers is k≦3.5 and the etch stop layer has a selectivity of at least 2.5:1 relative to the upper layer. Methods and apparatus for forming nitrogen doped silicon carbide films, for example, for use as etch stop layers are described.
    Type: Grant
    Filed: January 17, 2001
    Date of Patent: September 30, 2003
    Assignee: Trikon Holdings Ltd.
    Inventors: John MacNeil, Robert John Wilby, Knut Beekman
  • Gas delivery system
    Patent number: 6468386
    Abstract: A gas delivery system for plasma treatment apparatus includes a gas inlet, a plenum, a gas delivery plate extending across the downstream end of the plenum and a separate ionizer plate adjacent the downstream face of the gas delivery plate. The ionizer plate is formed with openings which are larger than the apertures in the gas delivery plate.
    Type: Grant
    Filed: March 3, 2000
    Date of Patent: October 22, 2002
    Assignee: Trikon Holdings Ltd.
    Inventor: Andrew Isaac Jeffryes
  • Apparatus and methods for sputtering
    Patent number: 6179974
    Abstract: This invention relates to sputtering materials onto workpieces. Sputter Apparatus which is generally indicated at 10, is provided with additional D.C. coils 23, 23, to increase uniformity of deposition.
    Type: Grant
    Filed: October 12, 1999
    Date of Patent: January 30, 2001
    Assignee: Trikon Holdings Ltd.
    Inventor: Keith Edward Buchanan