Abstract: The invention relates to a substrate having gate recesses or slots for the flow of molding resin, and related molding device and molding method in which said substrate is used. According to the invention, there is provided a substrate 10 having a multitude of chip pads 20 for mounting semiconductor chips, characterized in that gate recesses or slots 30 are formed along the resin routes 102 below the surface of the substrate 10 corresponding to the gate of mold 70, and the gate slots 30 extend from the edge of substrate 10 to the near part of the molded package 101.And according to the invention, the molding device and molding methods which properly use the gate recesses or slotted substrate 10 are provided.

Abstract: The present invention relates to a press for trimming and forming lead frames of semiconductor packages which have been molded in order to form individual semiconductor chips. The press machine for forming semiconductor packages according to the present invention is able to perform punching operation at low noise and high speed by vertically moving the upper mold mounted on an movable plate through a crank mechanism which is operated by a servomotor and has a characteristic of performing accelerated and decelerated motion with rotation, and also able to drive a feeding device by using the power of the servomotor which drives the press device, without using other driving source. And when there is caused such a trouble that a lead frame gets off the correct position, punching operation is interrupted to prevent any damage on semiconductor packages and a mold by lifting the movable plate provided with an upper mold.