Abstract: An inductor device includes a coil, two conductive bases and a shell. The coil is located over and coupled with the two conductive bases. The shell covers the coil and exposes partial conductor bases. The shell is made by an alloy material consisting of Fe, Cr, Si, Mn, S, C, P and Al. The weight ratio of Cr is 10.5%˜13.5%, Si is 0.1%˜0.5%, Mn is 0.1%˜1.0%, S is 0.01%˜0.053%, C is 0.01%˜0.05%, P is 0.01%˜0.05% and Al is 0.1%˜1.0%.

Abstract: A method to fabricate a molding inductor structure and a molding inductor structure are provided. The method comprises the steps of: performing a high pressure process on a first magnetic material to form a baseboard, wherein a central area of the baseboard comprises a pillar; providing a metal coil, wherein the metal coil comprises an open coil center; connecting the metal coil and the baseboard such that the pillar lodges in the open coil center; placing the connected metal coil and the baseboard into a mold; and forming a covering structure by stuffing a second magnetic material with a high pressure process to cover the connected metal coil and the baseboard to form the molding inductor structure.

Abstract: A method for fabricating a molding coil structure and a molding coil structure are provided. Forming at least one metal wire into a metal coil; forming a metal powder pillar with a high-pressure fabrication process; placing the metal powder pillar into a center of the metal coil; placing the metal coil and the metal pillar into a mold and stuffing a plurality of metal powder particles with high-pressure to form a covering structure surrounding and contacting the metal powder pillar and the metal coil to form the molding coil structure.