Abstract: A camera module of minimal size but with zoom function includes a zoom assembly, a base, and a fixed focus assembly. The zoom assembly and the fixed focus assembly are fixed in the base. The zoom assembly is driven by piezoelectric element instead of voice coil motor and includes an actuator and an optical unit. The actuator defines a first receiving groove holding the optical unit in place over the first through hole. When powered, the piezoelectric element changes a shape of the optical unit to change a focal length of the zoom assembly. An electronic device including such a camera module is also provided.

Abstract: A method for fabricating a composite lens holder with low-mass conductive metal and high-precision placement thereof to enable smaller-scale fabrication includes the steps of forming a plastic lens holder as a matrix, laser etching an outer surface of the plastic lens holder to form surface patterns, and electroless plating of metal on the surface patterns to form an effective coil, thereby producing the composite lens holder. A voice coil motor and an electronic device which use such a composite lens holder are also disclosed.

Abstract: A 3D sensing device includes a base, an infrared emitting module, a first infrared receiver, a second infrared receiver, a color camera module, a first moving member, a second moving member, a first driving member, and a second driving member. The first moving member and the second moving member are slidably mounted on the base. The first driving member and the second riving member respectively drive the first moving member and the second moving member to slide along the base. The infrared emitting module is mounted on the first moving member. The color camera module is located between the first infrared receiver and the infrared emitter. The second infrared receiver is mounted on the second moving member. The first moving member and the second moving member respectively move the infrared emitting module and the second infrared receiver along the base relative to the first infrared receiver.

Abstract: A testing device includes a positioning assembly and a testing assembly. The positioning assembly positions a workpiece. The testing assembly tests the workpiece. The positioning assembly includes a mounting seat defining a receiving slot for receiving and positioning the workpiece. The mounting seat includes a first positioning surface and a second positioning surface. The positioning assembly includes a side pusher configured to move toward the receiving slot. The side pusher includes a first pushing surface and a second pushing surface. When the side pusher is driven to move toward the receiving slot, the first pushing surface and the second pushing surface push two surfaces of the workpiece to make opposite two surfaces of the workpiece come in contact with the first positioning surface and the second positioning surface to position the workpiece in the receiving slot.

Abstract: A lens module includes a photosensitive chip, a hollow mounting frame, a filter, a lens holder, a lens, and a circuit board defining a first through hole and comprising a first surface and an opposite second surface. The photosensitive chip is installed on the first surface facing. The first surface includes electronic components and gold fingers installed thereon. One side of the photosensitive chip includes an electrical coupling portion electrically coupled to the gold fingers. The circuit board further includes an injection molding layer integrally formed onto the first surface. The injection molding layer seals the electronic components and the photosensitive chip therein. The mounting frame is fixed onto the second surface of the circuit board. The lens is installed within the lens holder. The lens holder is fixed onto a surface of the mounting frame facing away from the circuit board.

Abstract: A camera device proofed against ghosting and light flare includes a printed circuit board, an image sensor mounted on the printed circuit board, a supporting bracket fixed on the printed circuit board, and a lens module. The supporting bracket includes supporting plate and perpendicular side wall, the supporting plate and the side wall together forming a receiving room over the image sensor. The supporting plate has a central through hole for light ingress and a flange barrier protruding. The protruding flange barrier surrounds the light through hole, the lens module is fixed on the supporting surface, and the protruding flange barrier locates inside an inner side surface of the lens module.

Abstract: A voice coil motor includes a housing, a cover plate, an upper elastic member; a movable assembly, an immovable assembly, a lower elastic member, and a base cooperating with the housing to receive the cover plate, the upper elastic member, the movable assembly, the immovable assembly, and the lower elastic member. The base is made of laser direct structuring material. A metal layer is formed on a region of the base connecting the housing by Laser Direct Structuring processes, and the metal layer is fixed on the housing by laser welding or solder paste spot welding. The disclosure also provides an electronic device having the voice coil motor.

Abstract: A voice coil motor includes a base, a housing, a lower-resilient member, a lens frame, a coil, a magnet, an upper-resilient member, an upper cover plate, and a pin arranged on the base. The lower-resilient member, the lens frame, the coil, the magnet, the upper-resilient member, and the upper cover plate are arranged in sequence between the base and the housing. The lens frame and the coil are integrally formed. The coil surrounds an outer surface of the lens frame.

Abstract: An optical projector module proofed against distortion caused by heat building up in and around the light-emitting element includes a printed circuit board (PCB), a light emitting element, and an optical structure. The optical structure on the PCB includes a supporting member almost completely enclosing the light emitting element. The supporting member includes an embedded metal heat dissipating layer extending to cover outside surfaces of the supporting member. The metal heat dissipating layer occupies more than 70% of the outside surfaces of the supporting member, and being metallic the dissipating layer is able to conduct electricity.

Abstract: A camera module for facilitating industrialized water assembly includes a lens driver, a holder, a printed circuit board, and at least two conductive adhesives. The lens driver includes at least one pin. The lens driver is mounted on the holder. The pin extends from the lens driver to the holder. The holder includes at least one conductive layer corresponding to the pin. The conductive layer includes a first end and a second end opposite to the first end. The holder is mounted on the printed circuit board. One conductive adhesive connects the pin to the first end of the conductive layer, the other one conductive adhesive connects the second end of the conductive layer to the printed circuit board, that makes the conductive layer electrically connect to the printed circuit board.

Abstract: An encapsulation structure to protect an image sensor chip at all times during manufacture and use includes a printed circuit board, an image sensor chip, a supporting portion, a protecting film and a package portion. The image sensor chip is mounted on the printed circuit board and the supporting portion is mounted on the printed circuit board to surround the image sensor chip. The package portion is entirely opaque and is formed on the printed circuit board, the package portion encloses side wall of the supporting portion and the protecting film, and portion of surface of the protecting sheet away from the image sensor chip.

Abstract: An encapsulating structure to protect an image sensor chip at all times during manufacture and use includes a printed circuit board, an image sensor chip, a protecting sheet, and a package portion. The image sensor chip is mounted on the printed circuit board and the protecting sheet is mounted on the image sensor chip. The package portion is entirely opaque and is formed on the printed circuit board, the package portion encloses side wall of the image sensor chip, the protecting sheet, and portion of surface of the protecting sheet away from the image sensor chip. A method for manufacturing same is also disclosed.

Abstract: A lens module includes a circuit board, a hollow mounting bracket, a photosensitive chip, a lens base, and a lens. The photosensitive chip is mounted within the hollow mounting bracket on a surface of the circuit board. The lens base is mounted on a surface of the mounting bracket opposite to the circuit board. The lens base axially defines a through hole. The lens is mounted within the lens base. The lens base includes a screw thread formed along an inner wall of the through hole. The lens includes mating threads formed along a periphery of the lens contacting the inner wall of the through hole. The mating threads define at least one thread slot which defines a gap with the screw threads of the inner wall of the through hole.

Abstract: A camera module has a reduced light leakage. The camera module includes a printed circuit board and a mounting bracket mounted on the printed circuit board. The printed circuit board includes a first surface and at least one side surface perpendicularly connected to the first surface. Gaps are formed on the printed circuit board. The gaps extend from the first surface to a thickness direction of the first surface. Bumps are formed on the mounting bracket and correspondingly placed according to the gaps. Each of the bumps is received and fixed in a corresponding one of the gaps.

Abstract: A heat dissipating base for a light-emitting element sufficient to dissipate generated heat without additional means of dissipating includes a first base plate and a second base plate formed on the first base plate. The first base plate includes first sidewalls. The second base plate includes second sidewalls. The first base plate defines a first groove, the first groove passes through one first sidewall to form a first cutout. The second base plate defines a second groove, the second groove passes through one second sidewall to form a second cutout. The first cutout and the second cutout correspond to each other and cooperatively form a heat dissipating opening. The first groove and the second groove correspond to each other and cooperatively form a channel for dissipating heat. A light emitting device having such heat dissipating base is also provided.

Abstract: An optical projection module with improved heat dissipation includes a circuit board having a first surface and a second surface opposite the first surface. A semiconductor substrate is mounted on the first surface. The semiconductor substrate has a third surface facing the first surface and a fourth surface opposite to the third surface. A light source and an optical member are mounted on the fourth surface. The optical member includes a lens holder. The lens holder defines a receiving space for receiving the light source. The lens holder further defines at least one escaping hole. A heat dissipation block is received in each escaping hole.

Abstract: A lens module with enhanced absorption of stray light includes a sensor and a mounting bracket. The sensor includes a photosensitive area and a non-photosensitive area arranged surrounding the photosensitive area. The sensor is received in the mounting bracket and a window is defined in the mounting bracket. An annular flange extends from an inner wall of the window towards a center axis of the window. The annular flange includes a reflecting surface facing away from the inner wall of the window and tilted towards the sensor. The photosensitive area is exposed in a through hole of the annular flange. Diffusing reflection structures are formed on the reflecting surface and are configured to diffuse light incident on the non-photosensitive area away from the photosensitive area.

Abstract: A holder for a camera module includes first and second surfaces, an optical filter receiving groove is recessed from the first surface to the second surface to form a step portion and a glue receiving portions extend from angled abutments of the step portion. A sensor receiving groove is recessed from the second surface to the first surface, and the sensor receiving groove communicates with the optical filter receiving groove. At least one escape passage is defined in the holder, the at least one escape passage communicates with the optical filter receiving groove and the sensor receiving groove. The at least one escape passage abuts the glue receiving portions and provides an escape path for captured moisture and gases expanding or shrinking because of temperature variations.

Abstract: A optical projector device less vulnerable to deformation of projected light by generated heat includes a printed circuit board, a light source, and an optical module. The heat-generating light source emits a laser beam, the optical module being mounted on the printed circuit board and surrounding the light source. The optical module comprises a lens holder, a collimating optical element received in the lens holder, and a diffractive optical element away from the light source. The lens holder comprises an outer lens holder and an inner lens holder fixed in the outer lens holder, and the diffractive optical element is received in the inner lens holder, this arrangement enables the dissipation of any heat-expansion force away from these elements.

Abstract: An imaging chip packaging structure includes a circuit substrate, an imaging chip, and a pedestal. The circuit substrate has a first through hole extending through the circuit substrate. The imaging chip comprises a photosensitive area, and the first through hole through the substrate exposes the photosensitive area. The pedestal is integrated with the circuit substrate. The pedestal is formed on a first surface of the circuit substrate and comprises a second through hole on an optical path of the light reaching the imaging chip.